Hot dip metallization INC-AMB001

hot dip metallization
hot dip metallization
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hot dip
Type of substrate
nickel, aluminum


AMB Ceramic Substrate is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal. Advantage: The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better. Disadvantage: The reliability of AMB process depends largely on the composition of active filler metal, brazing process, brazing layer structure and many other key factors。 Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer’s drawings or samples



*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.