AMB Ceramic Substrate is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal.
The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better.
The reliability of AMB process depends largely on the composition of active filler metal, brazing process, brazing layer structure and many other key factors。
>Metallization thickness: 25 ±10um
>Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
Specialized Alumina materials with high insulation resistance
High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products.
Ceramic + Mo/Mn Metallized + plating Ni
Ceramic + Mo/Mn Metallized + plating Ag
Ceramic + Mo/Mn Metallized + plating Au
Ceramic + printing Ag
Special types are available according to customer’s drawings or samples