Ceramic substrate

DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications. Direct Bonded Copper Ceramic Substrates Material Property – Low Thermal Expansion – High Strength – High Thermal Conductivity – High Wettability for Solder Direct Bonded Copper Ceramic Substrates Applied Area – Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power Transistors – Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control – Home Appliance: Air Conditioner, Peltier Cooler – Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power – Industrial: LED Displays, Welding Machine – Aerospace: Laser, Power Supply for Satellites and Aircrafts – PC/IT: Power Supply, UPS System