Ceramic substrate

for power electronicsthick-film

Product Overview
The ceramic core is a precision component used inside wirewound RF chip inductors to support coil winding and create a stable inductive structure. Its geometry, groove, termination areas, and dimensional consistency influence winding position, coil stability, terminal connection, and automated assembly.

Manufacture and Function
Manufactured by precision ceramic forming and controlled metallization, these cores provide electrical insulation, mechanical support, and consistent dimensions for precision winding, terminal connection, lead-free soldering, or high-temperature bonding. Multiple structures, termination styles, and standard chip sizes are available for miniature, high-frequency RF chip inductors.

Product Features

• Designed for wirewound RF chip inductors and surface-mount winding and assembly
• High dimensional accuracy and batch consistency support stable winding and terminal connection
• Flat and L-shaped terminations are available for different electrode and assembly designs
• Tin-plated terminals support lead-free soldering; gold-plated terminals support high-temperature bonding
• Custom sizes, core structures, terminations, and metallization systems are available

Available Specifications
Item - Available Options
Ceramic Material - 96% Alumina Ceramic
Standard Size Codes - 0603, 0804, 1005, 1608, 2012, 2520, 3216
Core Structures - 2U / 2H / 4H
Termination Configurations - Flat Termination / L-Shaped Termination
Metallization System - Mo-Mn or Ag / Pd base layer, with optional Ni intermediate layer
Surface Finish - Standard Tin Plating / Optional Gold Plating

Typical Material Properties
Property | Unit | A-96 White Alumina
Alumina Content | % | 96
Bulk Density | g/cm³ | 3.7
Flexural Strength | MPa | 320
Dielectric Constant | – | 9.5
Dissipation Factor | ×10⁻³ | <10

Typical Applications
Used in wirewound ceramic RF chip inductors and other surface-mount high-frequency wirewound inductors for MHz-to-GHz circuits, wireless communication, communication equipment, automotive electronics, industrial electronics, and consumer electronics.

Caractéristiques / Spécifications techniques

• Material: 96% alumina ceramic
• Standard size codes: 0603, 0804, 1005, 1608, 2012, 2520, 3216
• Core structures: 2U, 2H, 4H
• Termination options: Flat termination, L-shaped termination
• Metallization: Mo-Mn or Ag/Pd base layer; optional Ni intermediate barrier
• Surface finish: Standard tin plating (for lead-free soldering) or optional gold plating (for high-temperature bonding)
• Bulk density: ~3.7 g/cm³
• Flexural strength: ~320 MPa
• Dielectric constant: ~9.5
• Dissipation factor: <10 ×10⁻³
• Applications: MHz–GHz wirewound RF chip inductors for wireless, automotive, industrial, and consumer electronics