Ceramic substrate

aluminum oxidealuminum nitride

Overview:
Aluminum nitride (AlN) ceramic substrates provide high thermal conductivity with electrical insulation and a low coefficient of thermal expansion, making them suited to dissipate heat in integrated circuits and semiconductor chip mounts. Innovacera thermally conductive ceramic interface pads, manufactured from AlN or alumina, improve heat transfer between components and cooling devices while preserving electrical isolation.

Advantages:

• Excellent thermal conductivity
• Low dielectric constant
• Low dielectric loss
• Reliable electrical insulation
• High mechanical strength; non-toxic
• High temperature and chemical corrosion resistance

Thermally conductive interface pads:
Ceramic thermally conductive interface pads fill microscopic air gaps between imperfect mating surfaces, creating a preferential thermal path from heat-generating components to heat sinks or cooling plates. Using AlN or alumina as the base material enhances thermal conductance while maintaining electrical insulation, suitable for high heat-flux assemblies.

Applications:

• Power devices and converters
• MOSFET and MOS transistor assemblies
• Heat sink interfaces
• Integrated circuit (IC) chip mounts and carriers
• Thermal management in packaging
• LED board thermal interface material (TIM)
• Chip-on-Film (COF) heat conduction
• IGBT transistor heat sinks

Technical specifications:

• Material: Aluminum nitride (AlN) ceramics; alumina also used for pads
• Thermal conductivity: AlN single crystal ≈250 W/m·K (theoretical values up to ≈320 W/m·K at room temperature)
• Low coefficient of thermal expansion (low CTE)
• High electrical resistivity and reliable insulation
• Low dielectric constant and low dielectric loss
• High mechanical strength and temperature resistance
• Chemical corrosion resistance
• Typical end uses: communication devices, high-brightness LEDs, power electronics