Ceramic ring

alumina

Alumina ceramic metallization discs, designed with 3 holes, were typically used in TO (Transistor Outline) packages. Providing the hermetic sealing, electrical insulation, and thermal stability in strict condition for high-reliability electronic packaging. Product Overview Alumina ceramic metallization is the process of applying molybdenum-manganese (Mo-Mn) then coating with Nickel on ceramics, bonding both the mechanical and electrical properties of ceramics and metals together. These three through-holes are to accommodate metal feedthrough pins, allowing for electrical interconnection while maintaining hermetic isolation. The metallized alumina disc forms the insulation base for TO packages like TO-3, TO-5, TO-8, TO-39, etc. Application Areas -TO Packages (e.g., TO-3, TO-5, TO-8, TO-39) -Power semiconductor devices -Laser diodes and optoelectronic packaging -RF and microwave device packaging -High-reliability and hermetically sealed sensors -Telecommunications and optical components -Medical, military, and aerospace electronics