Hot-pressed aluminum nitride

insulatinghigh thermal conductivity

Some extreme environments require high electrical resistivity in addition to exceptional thermal conductivity, high abrasion resistance, and high-temperature thermal cycling. To solve these challenges, Innovacera provides Hot-pressed aluminum nitride ceramic material solutions. Innovacera Hot pressed ALN ceramic components have a purity of 99.5% aluminum nitride and a density of about 3.3g/cm³. The thermal conductivity is 140-170 W/(m·k). The forming method of hot-pressed aluminum nitride ceramics is vacuum hot pressing sintering. After high temperature and high pressure, hot pressed ALN ceramic parts exhibit mechanical strength and hardness superior to those produced by tap-casting molding and cold isostatic press methods. Innovacera can provide hot-pressed aluminum nitride ceramic parts with a maximum size of Length 500 x width 500 x height < 350 mm and Outer diameter 500 x height < 500 mm. ITEM - UNIT - Testing Value Hardness - Kgf/mm² - 1070 Density - g/cm³ - 3.3 Fracture Toughness - MPa·m¹/² - 2.4 Thermal Conductivity - W/m·K - 140 Flexural Strength - MPa - 440 Characteristic Strength - MPa - 450 Coefficient Of Thermal Expansion - ×10⁻⁶/°C - 5 Dielectric Constant @1MHz - 9 Loss Tangent @1MHz - 0.00029 Features: - Excellent thermal conductivity - High electrical insulation - High dielectric strength - Resistant to high temperature and corrosion - Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors - Suitable for rigorous or abrasive environments - Cannot be eroded by all kinds of molten metals and molten hydrochloric acid Applications: - Semiconductor heaters - Magnetic resonance imaging equipment - Etching machines - Integrated circuit parts - Structural packaging materials - High-power heat dissipation insulating substrates - Microwave window materials - Compound semiconductor single crystal growth crucibles Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) in customized sizes. Welcome to send your inquiry to us. Technical Specifications: - Purity: 99.5% aluminum nitride - Density: 3.3 g/cm³ - Thermal conductivity: 140-170 W/(m·K) - Forming method: Vacuum hot pressing sintering - Maximum part size: Length 500 x width 500 x height < 350 mm; Outer diameter 500 x height < 500 mm - Hardness: 1070 Kgf/mm² - Fracture toughness: 2.4 MPa·m¹/² - Flexural strength: 440 MPa - Characteristic strength: 450 MPa - Coefficient of thermal expansion: 5 ×10⁻⁶/°C - Dielectric constant @1MHz: 9 - Loss tangent @1MHz: 0.00029