Ceramic sheet

aluminaaluminum nitrideinsulation

Product overview
TO-247 ceramic insulating sheet designed for TO-247 packages to provide electrical insulation and an efficient thermal interface. Manufactured from Alumina Ceramic (Al₂O₃) and Aluminum Nitride (AlN). Available in two variants: cooling pad with 3.7 mm holes and cooling pad without holes. Commonly used in high-power discrete semiconductor assemblies including MOSFETs, IGBTs and transistors.

Features

• Efficient heat transfer from high-power devices (MOSFETs, IGBTs, transistors)
• Stable performance under high thermal and electrical load
• Uniform pressure distribution for consistent contact
• Contributes to extended component lifetime and improved system reliability
• High thermal conductivity and electrical insulation balance

Applications

• Thermal interface for IGBT cooling pads, MOS transistor heat dissipation and thyristors
• DC power modules, motor drives and industrial inverter power electronics
• Solar inverters, wind turbine converters and battery management systems
• High-efficiency power supplies, amplifiers and UPS systems

Technical specifications

• Product type: TO-247 ceramic insulating sheet
• Materials: Alumina Ceramic (Al₂O₃) and Aluminum Nitride (AlN)
• Variants: with 3.7 mm holes; without holes
• Target package: TO-247
• Primary functions: electrical insulation and thermal interface for heat dissipation
• Typical use: DC power modules, motor drives, industrial inverters and power electronics