Ceramic substrate

aluminum nitridethin-layer

Product Overview
Innovacera's laser ceramic submount is a compact AlN ceramic base designed to sit beneath EML, VCSEL or edge-emitting Laser Diode chips. Within limited package footprints it integrates die mounting, electrical interconnection, electrical insulation and rapid heat dissipation, forming the interface between the laser chip and package base, copper base or heat sink.

Key Features

• High-thermal-conductivity AlN ceramic base
• Precision thin-film metallized circuits for die-attach, wire-bond and grounding
• Compatible with high-frequency interconnection and impedance-sensitive routing
• High surface flatness and tight geometric tolerances
• Reduced thermal-cycling stress for improved bonding reliability
• Custom geometries and metallization patterns available

Typical Applications

• 800G DR8 optical modules — submount for EML, Laser Diode or related laser chips in multi-channel parallel transmitters
• 800G FR4 optical modules — customized metallization and die-attach adapted to four-channel WDM transmitter layouts
• 1.6T DR8 / FR4 modules — for next-generation high-bandwidth data-center interconnects with increased heat-dissipation and miniaturization demands
• High-speed optical transceiver modules for switches, servers and DCI equipment
• TOSA and laser packaging — suitable for EML, DFB, edge-emitting diodes, VCSELs and custom laser packages
• Laser sensing and industrial optoelectronic devices — adaptable by chip power and package architecture

Role in 800G / 1.6T Upgrades

• Handles increased heat-flux density as channel rates and chip power rise
• Enables module miniaturization with dense chip, pad and trace layouts
• Supports high-frequency signal integrity through wire-bond length control, grounding design and parasitic management
• Meets volume-packaging requirements for flatness, metallization consistency and bonding reliability

Materials & Manufacturing
High thermal conductivity aluminum nitride (AlN) combined with precision thin-film metallization shortens thermal paths and provides a stable platform for die-attach, wire bonding and signal routing. Tight geometric tolerances and controlled surface finish enable reliable assembly in compact optical modules.

Customization & Development Support
Innovacera coordinates AlN outline, die-attach pads, wire-bond pads, ground metallization and surface finishes to meet thermal, electrical and mechanical requirements. Support includes design-for-manufacture evaluation, machining tolerances and sample development planning.

Technical Specifications

• Material: Aluminum Nitride (AlN) ceramic — high thermal conductivity
• Functions: die mounting, electrical interconnection, insulation, heat dissipation
• Metallization: precision thin-film metallized circuits for die-attach, wire-bond pads, grounding and signal routing
• Precision: high surface flatness and tight geometric tolerances for ultra-flat die attach
• Electrical: suitable for high-frequency interconnection and impedance-sensitive routing
• Reliability: reduced thermal-cycling stress and optimized bonding reliability for high-power laser packaging
• Form factor: compact submounts for limited package footprints (DR8/FR4 and similar)
• Customization: custom structures and metallization patterns to match chip electrode layouts and package architectures