Ceramic substrate

sapphirefor power electronicsaluminum oxide

Product overview
High-performance ceramic substrates including alumina (Al2O3), aluminum nitride (AlN), zirconia-toughened alumina (ZTA), silicon nitride (Si3N4) and SiC. Designed for power electronics, EV modules and high-voltage systems to combine thermal management with electrical insulation.

Why engineers choose ceramic substrates

• Efficient thermal management: high thermal conductivity removes heat from active devices, lowering junction temperature.
• Strong electrical insulation: high dielectric strength supports high-voltage operation and reduces leakage risk.
• Mechanical reliability: high flexural strength resists vibration and thermal cycling.
• Long-term stability: chemically inert materials maintain performance in harsh industrial environments.

Materials (available)

• Alumina (Al2O3)
• Aluminum nitride (AlN)
• Silicon nitride (Si3N4)
• Zirconia-toughened alumina (ZTA)
• Zirconia (ZrO2)
• Silicon carbide (SiC)
• Boron nitride, sapphire, porous ceramics, machinable glass-ceramics, etc.

Material features
Alumina (Al2O3)
Cost-effective general-purpose substrate suitable for standard power modules and industrial electronics.

Aluminum nitride (AlN)
High thermal conductivity with CTE close to silicon, ideal for high heat-flux designs such as IGBT, MOSFET modules and EV inverters.

ZTA (zirconia-toughened alumina)
Improved fracture toughness and mechanical durability for structurally demanding environments.

Silicon nitride (Si3N4)
Balanced strength and thermal conductivity, suited to severe thermal cycling designs and automotive EV power modules.

Applications

• Power electronics modules
• EV inverters and converters
• Renewable energy power systems
• Industrial motor drives
• High-voltage power systems
• RF and high-frequency electronics

Custom manufacturing capabilities

• Custom sizes and tight tolerances
• Precision machining and laser cutting
• Metallization (Mo/Mn) and DBC compatibility
• Available in a range of thicknesses and shapes
• Design support considering system-level reliability

Technical advantages and reliability
Combines high thermal conductivity, strong electrical insulation, mechanical durability and chemical stability to reduce thermal risk and improve lifetime. Engineering support is provided for material selection and processing to match system design constraints.

Frequently asked questions (excerpt)

• Which ceramic substrate is best for power electronics? — AlN and Si3N4 are commonly used where high thermal conductivity and mechanical strength are required.
• What is the difference between alumina and AlN substrates? — AlN has substantially higher thermal conductivity and a CTE closer to silicon than alumina.
• Can ceramic substrates withstand high voltage? — Yes, they offer high dielectric strength suitable for high-voltage applications.

Features / Specifications

• Materials: Al2O3, AlN, Si3N4, ZTA, ZrO2, SiC, etc.
• Main uses: power electronics, EV modules, high-voltage systems, RF equipment
• Processing/finishes: precision machining, laser cutting, metallization (Mo/Mn), DBC-ready
• Tolerances: custom tight tolerances available (defined during specification)
• Performance characteristics (typical): high thermal conductivity, strong electrical insulation, high flexural strength, chemical stability