Aluminum heat sink

customfor LEDsfor printed circuit boards

Product description
Aluminium Graphite combines high lateral thermal conductivity with low density and a low coefficient of thermal expansion. The material can be manufactured into a wide range of geometries and offers a functional surface suitable for soldering processes. These properties make Aluminium Graphite heat sinks particularly effective for conducting heat away from localized hot spots in power electronics and semiconductor assemblies.

Benefits

• Customized expansion behavior matched to substrate and semiconductor materials
• Customer-specific designs and form factors
• Functional surface finishes compatible with soldering
• Optimized cost-to-performance ratio for thermal management

Applications

• Heat spreading and hot-spot removal in power electronics
• Cooling modules for LEDs and luminaires
• High-density semiconductor packages and modules
• Thermal interfaces requiring CTE matching

Technical specifications

• Material: Aluminium Graphite
• High lateral thermal conductivity for efficient heat spreading
• Low coefficient of thermal expansion
• Low material density
• Manufacturable in diverse geometries; surface suitable for soldering processes