Liquid-cooled cold plate

aluminumcopper

Product Overview
The KLC Thermal Test Vehicle (TTV) with integrated heatsink or cold plate is a one-piece thermal validation device where the heater is structurally embedded into the heatsink. By removing TIM variability, the design provides realistic, repeatable thermal data for AI servers, OAM modules, GPUs, ASICs and high-density HPC cooling systems.

Key Advantages

• Zero-TIM uncertainty due to heater–heatsink structural integration for high measurement accuracy.
• Very high power capability suitable for extreme-load validation of AI/GPU/HPC cooling solutions.
• Compatible with air, liquid, immersion and power-electronics cooling scenarios.
• Delivered pre-assembled with UL-certified leads and CAD STEP files to accelerate CFD correlation and integration.

Key Features

• TTV with integrated heatsink (one-piece construction) — eliminates interface and mounting-pressure variables.
• High power density — supports up to 12,800 W total power and up to 500 W/cm² heat flux for hotspot and chip-scale validation.
• Mechanical customization — base sizes from 30×30 mm to 80×80 mm or fully custom dimensions.
• Electrical options — adjustable voltage range 12V–600V or fixed 110V/220V configurations.
• Fin designs — tailored for air or liquid cooling; fin height customizable from 10 mm to 100 mm.
• Embedded sensors — optional multi-point temperature sensors for real-time thermal mapping.

Technical Specifications Summary

• Base material: high-purity copper
• Heatsink material: copper, aluminum or hybrid
• Standard base sizes: 30×30, 35×35, 40×40, 50×50, 60×60, 80×80 mm (custom available)
• Voltage: 12V–600V (adjustable); fixed 110V & 220V options
• Max power density: up to 500 W/cm²
• Max total power: up to 12,800 W
• Fin height: 10 mm to 100 mm (customizable)
• Cooling methods: air-cooled, liquid-cooled, immersion, power-electronics cooling
• CFD support: 3D STEP files and detailed thermal characteristics provided

Applications

• AI server thermal testing — validate OAM/GPU cooling under extreme heat loads.
• Liquid cooling development — characterize cold-plate flow distribution and pressure drop.
• Air cooling validation — optimize fin geometries and airflow for heat transfer.
• Design verification testing (DVT) — repeatable stress tests without risking real chips.

How to Select Your TTV with Heatsink

• Define the cooling method: air, liquid, immersion or power-electronics environment.
• Specify target power and power density (W and W/cm²).
• Choose base size and fin configuration (height, spacing, pattern) according to flow and mechanical constraints.
• Decide sensor integration: placement and number of temperature measurement points.
• Specify any hotspot zoning, thermal resistance targets (K/W) and mounting-hole patterns.

FAQ

• Q: Can fins be hybrid copper/aluminum?
  A: Yes — a copper base with aluminum fins is supported to balance thermal performance and cost.
• Q: Is the TTV suitable for two-phase immersion cooling?
  A: Yes — materials and surface treatments can be made compatible with common dielectric fluids.
• Q: Does the TTV include temperature sensors?
  A: Optional multi-point embedded sensors are available for real-time thermal mapping.
• Q: What power levels can it simulate?
  A: Up to 12,800 W total power and 500 W/cm² heat flux.

Deliverables & Engineering Support

• Pre-assembled units with UL-certified leads.
• 3D STEP files and detailed thermal characteristics for CFD and simulation correlation.
• Customization support for mechanical base, mounting interfaces, power configuration and sensor placements.