DC electronic load TTE

Short description

• Modular thermal load emulator for high-power CPUs, GPUs and server components
• Designed for rack-level testing and immersion-cooling validation
• Modular output scalable up to rack configurations (~12,000 W)
• Module size: 200×275×35 mm (per module)

Overview

• The Thermal Test Emulator (TTE) is a Thermal Test Vehicle (TTV) engineered to reproduce the thermal output of high-performance processors and semiconductor devices for R&D and data center validation.
• Multiple TTV modules combine to simulate the total heat load of a server board, rack or cabinet, enabling system-level thermal assessment before production hardware is available.
• Applicable to air, liquid, cold-plate and immersion cooling evaluation in lab and production-like environments.

Key Features

• Accurate heat simulation: Real-time thermal power profiles for CPU, GPU, HPC and AI server workloads with modular outputs scalable to rack-level configurations.
• Finned module design: Improves convective/immersion heat transfer for representative thermal dissipation.
• Cooling-system compatibility: Integrates with immersion tanks, liquid-cooling loops, cold plates and air-cooled racks.
• Rack integration: Mechanical and electrical form factors suited for rapid installation in server systems and test racks.

Benefits

• Enables validation and optimization of thermal management strategies for high-density electronics and AI/HPC infrastructures.
• Reduces development cost and time by simulating realistic heat loads without final production components.
• Supports qualification of immersion and advanced liquid-cooling solutions for data center deployments.

Applications

• Performance and thermal profiling of CPUs, GPUs and HPC components under controlled load scenarios.
• Development and validation of cooling systems, heat sinks and CDUs for racks and cabinets.
• R&D labs, data center staging, pre-production thermal verification and qualification tests.

Thermal Emulator Specifications (table)
Power Output | Voltage (V) | Current (A) | Dimensions (mm)
1600 W | 50 V | 32 A | 200×275×35 (1 module)
3200 W | 50 V | 64 A | 200×275×35 (2 modules)
4800 W | 50 V | 96 A | 200×275×35 (3 modules)
9600 W | 50 V | 128 A | 200×275×35 (4 modules)
Custom up to ~12,000 W (rack) | 50 V | up to 200 A | configurable


Customization

• Voltage, current, module count and mechanical layout can be customized to match specific test scenarios and rack architectures.

Technical specifications

• Standard modules: 1600 W (50 V, 32 A) — module size 200×275×35 mm
• Modular combinations: 1–4 standard modules (scalable to rack-level via multiple assemblies)
• Custom configurations: up to specified high-power assemblies (contact for higher-power and bespoke designs)
• Target environments: R&D labs, server rooms, HPC/AI clusters, immersion-cooling testbeds
• Functional features: high‑precision temperature control, finned heat-spreader design, compatibility with immersion and liquid cooling systems