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AC electronic load KLC TTV 2.0

AC electronic load - KLC TTV 2.0 - Taiwan King Lung Chin PTC Co., Ltd.
AC electronic load - KLC TTV 2.0 - Taiwan King Lung Chin PTC Co., Ltd.
AC electronic load - KLC TTV 2.0 - Taiwan King Lung Chin PTC Co., Ltd. - image - 2
AC electronic load - KLC TTV 2.0 - Taiwan King Lung Chin PTC Co., Ltd. - image - 3
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AC electronic load - KLC TTV 2.0 - Taiwan King Lung Chin PTC Co., Ltd. - image - 6
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Characteristics

Options
AC
Power

Min.: 120 W

Max.: 250 W

Voltage

Min.: 0 V

Max.: 260 V

Description

Product Overview
The KLC TTV 2.0 Multi-Zone Power Thermal Test Vehicle is a standardized, modular thermal test platform designed to reproduce realistic, non-uniform thermal distributions of modern AI processors, GPUs, CPUs, chiplets and HBM stacks. Built on the KLC TTV 2.0 Standardized Platform, it features independent power zones, custom heating patterns, multi-point temperature monitoring and integrated controller solutions. NEW | Patent Pending. Updated July 2026.

Built-in Highlights
  • Independent Power Zone Configuration
  • Customizable Heating Zone Layouts (standard 15 or 25 zones; other layouts customizable)
  • Multi-Point Temperature Monitoring with embedded T-type thermocouples (optional RTD/K-type)
  • Integrated multi-zone controller, temperature control and power monitoring
  • Adjustable AC power supply compatibility (110/220 VAC input; adjustable output options)

Key Features
  • Multi-Zone Power Configuration supporting independently controlled zones
  • Custom power zones matched to customer power map layouts to emulate GPU/CPU/Chiplet/HBM heat distributions
  • Flexible sensor configuration: built-in T-Type thermocouples, optional RTD sensors, and custom sensor layouts
  • Integrated controller system for temperature control, power monitoring and multi-zone control
  • Adjustable super high-power output via varying input voltage to emulate high-power AI processors
  • High-conductivity hybrid structure and low thermal resistance design
  • 100% embedded T-type temperature sensors (standard)

Benefits
  • Higher thermal simulation accuracy and realistic hotspot emulation
  • Independent zone operation to explore numerous workload scenarios
  • Improved cooling-system optimization and thermal design verification
  • Faster thermal design verification and reduced product development time
  • High reliability for extreme power density testing

Power Density Options
  • High Power: 150–300 W/cm²
  • Ultra High Power: 500–1,000+ W/cm² (available for custom projects)

Available Power–Voltage Configurations (12V ~ 600V) — table format: Dimensions (mm) | Adjustable Voltage (V) | Power Range (W) | Maximum Current (A)
30 x 30 | 12 ~ 48 | 5 ~ 280 | 6
30 x 30 | 24 ~ 80 | 15 ~ 800 | 10
30 x 30 | 48 ~ 120 | 20 ~ 1600 | 15
30 x 30 | 80 ~ 200 | 50 ~ 2000 | 16
30 x 30 | 120 ~ 250 | 100 ~ 2000 | 16
30 x 30 | 200 ~ 400 | 300 ~ 2000 | 7
30 x 30 | 250 ~ 600 | 450 ~ 2000 | 7
35 x 35 | 12 ~ 48 | 5 ~ 400 | 10
35 x 35 | 24 ~ 80 | 15 ~ 1000 | 14
35 x 35 | 48 ~ 120 | 30 ~ 2000 | 20
35 x 35 | 80 ~ 200 | 100 ~ 2200 | 20
35 x 35 | 120 ~ 250 | 200 ~ 2500 | 12
35 x 35 | 200 ~ 400 | 500 ~ 2500 | 8
35 x 35 | 250 ~ 600 | 750 ~ 2500 | 6
40 x 40 | 12 ~ 48 | 5 ~ 380 | 8
40 x 40 | 24 ~ 80 | 20 ~ 1000 | 13
40 x 40 | 48 ~ 120 | 60 ~ 2000 | 19
40 x 40 | 80 ~ 200 | 80 ~ 2400 | 20
40 x 40 | 120 ~ 250 | 200 ~ 3000 | 16
40 x 40 | 200 ~ 400 | 500 ~ 3200 | 11
40 x 40 | 250 ~ 600 | 800 ~ 3200 | 11
50 x 50 | 12 ~ 48 | 10 ~ 380 | 8.0
50 x 50 | 24 ~ 80 | 25 ~ 1000 | 13.3
50 x 50 | 48 ~ 120 | 60 ~ 1600 | 17
50 x 50 | 80 ~ 200 | 150 ~ 2500 | 15
50 x 50 | 120 ~ 250 | 300 ~ 4000 | 19
50 x 50 | 200 ~ 400 | 850 ~ 4500 | 10
50 x 50 | 250 ~ 600 | 1400 ~ 5000 | 11
60 x 60 | 12 ~ 48 | 10 ~ 280 | 6
60 x 60 | 24 ~ 80 | 20 ~ 800 | 10
60 x 60 | 48 ~ 120 | 80 ~ 1800 | 15
60 x 60 | 80 ~ 200 | 200 ~ 2400 | 13
60 x 60 | 120 ~ 250 | 450 ~ 3600 | 15
60 x 60 | 200 ~ 400 | 1300 ~ 4600 | 12
60 x 60 | 250 ~ 600 | 2000 ~ 5000 | 12.5
80 x 80 | 12 ~ 48 | 10 ~ 450 | 10
80 x 80 | 24 ~ 80 | 20 ~ 1200 | 16
80 x 80 | 48 ~ 120 | 80 ~ 2000 | 20
80 x 80 | 80 ~ 200 | 200 ~ 3000 | 19
80 x 80 | 120 ~ 250 | 400 ~ 4000 | 21
80 x 80 | 200 ~ 400 | 1200 ~ 6000 | 19
80 x 80 | 250 ~ 600 | 1800 ~ 8000 | 15

110V / 220V Super High-Power Configurations — table format: Voltage (V) | Dimensions (mm) | Selectable Power (W)
110 | 30 x 30 | 80, 260, 1500
110 | 35 x 35 | 130, 550, 2100
110 | 40 x 40 | 150, 400, 2000
110 | 50 x 50 | 250, 500, 2000
110 | 60 x 60 | 360, 740, 1500
110 | 80 x 80 | 320, 660, 2400
220 | 30 x 30 | 320, 1000
220 | 35 x 35 | 540, 2200
220 | 40 x 40 | 600, 1600
220 | 50 x 50 | 1000, 2000
220 | 60 x 60 | 1500, 3000, 6000
220 | 80 x 80 | 1300, 2600, 9600

Customization & Options
  • Custom dimensions and thickness (standard examples: 30 × 30 mm to 80 × 80 mm; other sizes by request)
  • Custom zone layout, power density, voltage, connectors and sensor configuration
  • Integration of NTC, RTD, thermocouples and other temperature sensor types
  • Mounting fixtures including upper/lower clamp plates and fixing pressure assemblies
  • Application-specific thermal designs for liquid cooling, cold plate, heat pipe, immersion and two-phase cooling

Primary Applications
  • AI server thermal validation
  • AI processor, GPU and CPU thermal characterization
  • AI accelerator and ASIC thermal testing
  • Chiplet thermal validation and HBM cooling evaluation
  • Cold plate, liquid cooling, direct-to-chip and two-phase cooling validation
  • High heat-flux cooling research and semiconductor thermal characterization

Complete AI Thermal Validation Solution
  • Multi-Zone Thermal Test Vehicle
  • T-type sensors and optional RTD/K-type sensors
  • Temperature controllers and multi-zone controllers
  • Upper and lower clamp plates and fixing pressure assembly
  • Cold plate fixtures and adjustable power supplies

Caractéristiques / Spécifications techniques
  • Modèle: KLC TTV 2.0
  • Architecture: Standardized, modular TTV 2.0 platform
  • Standard zone configurations: 15-zone, 25-zone (custom layouts available)
  • Sensor options: Embedded T-type thermocouples (standard), optional RTD, K-type, NTC
  • Power input compatibility: 110/220 VAC input; adjustable output configurations (examples include 0–260 VAC adjustable output options per configuration)
  • Power density capability: Typical 150–300 W/cm²; ultra-high-power options up to 500–1,000+ W/cm² for custom projects
  • Typical sizes (examples): 30×30 mm up to 80×80 mm (custom sizes possible)
  • Materials/Structure: High-conductivity hybrid structure with low thermal resistance and copper block structures available for cold plate validation
  • Integrated control: Multi-zone temperature/power control, multi-point monitoring and power monitoring
  • Lead time (typical): ~6–8 weeks depending on project complexity
  • Regulatory / status: Patent pending; updated July 2026
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.