Product OverviewThe KLC TTV 2.0 Multi-Zone Power Thermal Test Vehicle is a standardized, modular thermal test platform designed to reproduce realistic, non-uniform thermal distributions of modern AI processors, GPUs, CPUs, chiplets and HBM stacks. Built on the KLC TTV 2.0 Standardized Platform, it features independent power zones, custom heating patterns, multi-point temperature monitoring and integrated controller solutions. NEW | Patent Pending. Updated July 2026.
Built-in Highlights- Independent Power Zone Configuration
- Customizable Heating Zone Layouts (standard 15 or 25 zones; other layouts customizable)
- Multi-Point Temperature Monitoring with embedded T-type thermocouples (optional RTD/K-type)
- Integrated multi-zone controller, temperature control and power monitoring
- Adjustable AC power supply compatibility (110/220 VAC input; adjustable output options)
Key Features- Multi-Zone Power Configuration supporting independently controlled zones
- Custom power zones matched to customer power map layouts to emulate GPU/CPU/Chiplet/HBM heat distributions
- Flexible sensor configuration: built-in T-Type thermocouples, optional RTD sensors, and custom sensor layouts
- Integrated controller system for temperature control, power monitoring and multi-zone control
- Adjustable super high-power output via varying input voltage to emulate high-power AI processors
- High-conductivity hybrid structure and low thermal resistance design
- 100% embedded T-type temperature sensors (standard)
Benefits- Higher thermal simulation accuracy and realistic hotspot emulation
- Independent zone operation to explore numerous workload scenarios
- Improved cooling-system optimization and thermal design verification
- Faster thermal design verification and reduced product development time
- High reliability for extreme power density testing
Power Density Options- High Power: 150–300 W/cm²
- Ultra High Power: 500–1,000+ W/cm² (available for custom projects)
Available Power–Voltage Configurations (12V ~ 600V) — table format: Dimensions (mm) | Adjustable Voltage (V) | Power Range (W) | Maximum Current (A)30 x 30 | 12 ~ 48 | 5 ~ 280 | 6
30 x 30 | 24 ~ 80 | 15 ~ 800 | 10
30 x 30 | 48 ~ 120 | 20 ~ 1600 | 15
30 x 30 | 80 ~ 200 | 50 ~ 2000 | 16
30 x 30 | 120 ~ 250 | 100 ~ 2000 | 16
30 x 30 | 200 ~ 400 | 300 ~ 2000 | 7
30 x 30 | 250 ~ 600 | 450 ~ 2000 | 7
35 x 35 | 12 ~ 48 | 5 ~ 400 | 10
35 x 35 | 24 ~ 80 | 15 ~ 1000 | 14
35 x 35 | 48 ~ 120 | 30 ~ 2000 | 20
35 x 35 | 80 ~ 200 | 100 ~ 2200 | 20
35 x 35 | 120 ~ 250 | 200 ~ 2500 | 12
35 x 35 | 200 ~ 400 | 500 ~ 2500 | 8
35 x 35 | 250 ~ 600 | 750 ~ 2500 | 6
40 x 40 | 12 ~ 48 | 5 ~ 380 | 8
40 x 40 | 24 ~ 80 | 20 ~ 1000 | 13
40 x 40 | 48 ~ 120 | 60 ~ 2000 | 19
40 x 40 | 80 ~ 200 | 80 ~ 2400 | 20
40 x 40 | 120 ~ 250 | 200 ~ 3000 | 16
40 x 40 | 200 ~ 400 | 500 ~ 3200 | 11
40 x 40 | 250 ~ 600 | 800 ~ 3200 | 11
50 x 50 | 12 ~ 48 | 10 ~ 380 | 8.0
50 x 50 | 24 ~ 80 | 25 ~ 1000 | 13.3
50 x 50 | 48 ~ 120 | 60 ~ 1600 | 17
50 x 50 | 80 ~ 200 | 150 ~ 2500 | 15
50 x 50 | 120 ~ 250 | 300 ~ 4000 | 19
50 x 50 | 200 ~ 400 | 850 ~ 4500 | 10
50 x 50 | 250 ~ 600 | 1400 ~ 5000 | 11
60 x 60 | 12 ~ 48 | 10 ~ 280 | 6
60 x 60 | 24 ~ 80 | 20 ~ 800 | 10
60 x 60 | 48 ~ 120 | 80 ~ 1800 | 15
60 x 60 | 80 ~ 200 | 200 ~ 2400 | 13
60 x 60 | 120 ~ 250 | 450 ~ 3600 | 15
60 x 60 | 200 ~ 400 | 1300 ~ 4600 | 12
60 x 60 | 250 ~ 600 | 2000 ~ 5000 | 12.5
80 x 80 | 12 ~ 48 | 10 ~ 450 | 10
80 x 80 | 24 ~ 80 | 20 ~ 1200 | 16
80 x 80 | 48 ~ 120 | 80 ~ 2000 | 20
80 x 80 | 80 ~ 200 | 200 ~ 3000 | 19
80 x 80 | 120 ~ 250 | 400 ~ 4000 | 21
80 x 80 | 200 ~ 400 | 1200 ~ 6000 | 19
80 x 80 | 250 ~ 600 | 1800 ~ 8000 | 15
110V / 220V Super High-Power Configurations — table format: Voltage (V) | Dimensions (mm) | Selectable Power (W)110 | 30 x 30 | 80, 260, 1500
110 | 35 x 35 | 130, 550, 2100
110 | 40 x 40 | 150, 400, 2000
110 | 50 x 50 | 250, 500, 2000
110 | 60 x 60 | 360, 740, 1500
110 | 80 x 80 | 320, 660, 2400
220 | 30 x 30 | 320, 1000
220 | 35 x 35 | 540, 2200
220 | 40 x 40 | 600, 1600
220 | 50 x 50 | 1000, 2000
220 | 60 x 60 | 1500, 3000, 6000
220 | 80 x 80 | 1300, 2600, 9600
Customization & Options- Custom dimensions and thickness (standard examples: 30 × 30 mm to 80 × 80 mm; other sizes by request)
- Custom zone layout, power density, voltage, connectors and sensor configuration
- Integration of NTC, RTD, thermocouples and other temperature sensor types
- Mounting fixtures including upper/lower clamp plates and fixing pressure assemblies
- Application-specific thermal designs for liquid cooling, cold plate, heat pipe, immersion and two-phase cooling
Primary Applications- AI server thermal validation
- AI processor, GPU and CPU thermal characterization
- AI accelerator and ASIC thermal testing
- Chiplet thermal validation and HBM cooling evaluation
- Cold plate, liquid cooling, direct-to-chip and two-phase cooling validation
- High heat-flux cooling research and semiconductor thermal characterization
Complete AI Thermal Validation Solution- Multi-Zone Thermal Test Vehicle
- T-type sensors and optional RTD/K-type sensors
- Temperature controllers and multi-zone controllers
- Upper and lower clamp plates and fixing pressure assembly
- Cold plate fixtures and adjustable power supplies
Caractéristiques / Spécifications techniques- Modèle: KLC TTV 2.0
- Architecture: Standardized, modular TTV 2.0 platform
- Standard zone configurations: 15-zone, 25-zone (custom layouts available)
- Sensor options: Embedded T-type thermocouples (standard), optional RTD, K-type, NTC
- Power input compatibility: 110/220 VAC input; adjustable output configurations (examples include 0–260 VAC adjustable output options per configuration)
- Power density capability: Typical 150–300 W/cm²; ultra-high-power options up to 500–1,000+ W/cm² for custom projects
- Typical sizes (examples): 30×30 mm up to 80×80 mm (custom sizes possible)
- Materials/Structure: High-conductivity hybrid structure with low thermal resistance and copper block structures available for cold plate validation
- Integrated control: Multi-zone temperature/power control, multi-point monitoring and power monitoring
- Lead time (typical): ~6–8 weeks depending on project complexity
- Regulatory / status: Patent pending; updated July 2026