Electronic test fixture KLC TTV 2.0

Product overview

• Built on the KLC TTV 2.0 standardized platform
• Independent multi-zone hotspot simulation
• Support for high and ultra-high power density
• Validation for chiplets, AI accelerators, GPUs, CPUs and HBM stacks
• Full customization and integrated sensor/controller options

Summary
The KLC TTV 2.0 Multi‑Zone Power Thermal Test Vehicle reproduces realistic, non‑uniform heat distributions using independently configurable heating zones, custom heating patterns and multi‑point temperature monitoring. It enables accurate validation of cold plates, liquid cooling, direct‑to‑chip cooling, immersion and two‑phase cooling systems for high‑density semiconductor packages.

Built on KLC TTV 2.0 standardized platform

• Standardized dimensions and thickness to shorten lead time
• Modular design to accelerate R&D iterations
• High‑conductivity hybrid structure and low thermal resistance
• 100% embedded T‑type sensors for real‑time monitoring
• Full customization maintained for project‑specific requirements

Why multi‑zone matters
Modern heterogeneous packaging generates localized hotspots and steep thermal gradients. Multi‑zone operation provides independent power control per zone to emulate real workload maps and deliver more representative thermal validation than single‑zone solutions.

Benefits

• Improved thermal simulation accuracy
• Realistic hotspot emulation
• Independent power control per zone
• Faster thermal design verification
• Optimization of cold plates and liquid/two‑phase cooling
• Reduced product development time

Key features

• Multi‑zone power configurations: standard 15‑zone and 25‑zone examples (custom layouts available)
• Custom power zones matched to customer power maps (GPU/CPU/chiplet/HBM)
• Flexible sensor options: embedded T‑type thermocouples, optional RTD/K‑type, customizable layouts
• Integrated controller: multi‑zone temperature control and power monitoring
• Adjustable AC supply: compatible with 110/220 VAC input and adjustable output ranges
• Adjustable super high‑power output enabling wide power‑density ranges via input voltage control

Available power density options (examples)

• High Power: 150–300 W/cm²
• Ultra High Power: 500–1,000+ W/cm² (custom projects)

Primary applications

• AI server thermal validation
• AI processor, GPU and CPU thermal characterization
• AI accelerator and ASIC thermal testing
• Chiplet and HBM cooling evaluation
• Cold plate, liquid cooling, direct‑to‑chip, two‑phase and immersion cooling validation
• High heat‑flux cooling research

Complete thermal validation ecosystem (components)

• Multi‑Zone Thermal Test Vehicle
• Embedded T‑type sensors and optional sensor types
• Temperature controller and multi‑zone monitoring system
• Upper/lower clamp plates and fixing pressure assembly
• Cold plate fixtures and adjustable power supplies

Customization options
Dimensions and thickness, heating zone layout and count, power density (W/cm²), operating voltage, sensor types (T, RTD, K, NTC), adjustable AC supply, connectors, mounting fixtures and application‑specific thermal design. Standard sample sizes: 30×30 mm up to 80×80 mm; other sizes on request.

How to select your TTV

• Define target power range and operating voltage for the test scenario
• Specify footprint, heat‑flux and mounting constraints
• Choose temperature monitoring approach: integrated sensors or external measurement
• Receive engineering recommendation and final technical specification

Tables — 12V~600V Super High‑Power Thermal Test Vehicle (TTV)
Dimensions (mm) | Adjustable Voltage (V) | Power Range (W) | Max Current (A)
30 x 30 | 12 ~ 48 | 5 ~ 280 | 6
30 x 30 | 24 ~ 80 | 15 ~ 800 | 10
30 x 30 | 48 ~ 120 | 20 ~ 1600 | 15
30 x 30 | 80 ~ 200 | 50 ~ 2000 | 16
30 x 30 | 120 ~ 250 | 100 ~ 2000 | 16
30 x 30 | 200 ~ 400 | 300 ~ 2000 | 7
30 x 30 | 250 ~ 600 | 450 ~ 2000 | 7
35 x 35 | 12 ~ 48 | 5 ~ 400 | 10
35 x 35 | 24 ~ 80 | 15 ~ 1000 | 14
35 x 35 | 48 ~ 120 | 30 ~ 2000 | 20
35 x 35 | 80 ~ 200 | 100 ~ 2200 | 20
35 x 35 | 120 ~ 250 | 200 ~ 2500 | 12
35 x 35 | 200 ~ 400 | 500 ~ 2500 | 8
35 x 35 | 250 ~ 600 | 750 ~ 2500 | 6
40 x 40 | 12 ~ 48 | 5 ~ 380 | 8
40 x 40 | 24 ~ 80 | 20 ~ 1000 | 13
40 x 40 | 48 ~ 120 | 60 ~ 2000 | 19
40 x 40 | 80 ~ 200 | 80 ~ 2400 | 20
40 x 40 | 120 ~ 250 | 200 ~ 3000 | 16
40 x 40 | 200 ~ 400 | 500 ~ 3200 | 11
40 x 40 | 250 ~ 600 | 800 ~ 3200 | 11
50 x 50 | 12 ~ 48 | 10 ~ 380 | 8.0
50 x 50 | 24 ~ 80 | 25 ~ 1000 | 13.3
50 x 50 | 48 ~ 120 | 60 ~ 1600 | 17
50 x 50 | 80 ~ 200 | 150 ~ 2500 | 15
50 x 50 | 120 ~ 250 | 300 ~ 4000 | 19
50 x 50 | 200 ~ 400 | 850 ~ 4500 | 10
50 x 50 | 250 ~ 600 | 1400 ~ 5000 | 11
60 x 60 | 12 ~ 48 | 10 ~ 280 | 6
60 x 60 | 24 ~ 80 | 20 ~ 800 | 10
60 x 60 | 48 ~ 120 | 80 ~ 1800 | 15
60 x 60 | 80 ~ 200 | 200 ~ 2400 | 13
60 x 60 | 120 ~ 250 | 450 ~ 3600 | 15
60 x 60 | 200 ~ 400 | 1300 ~ 4600 | 12
60 x 60 | 250 ~ 600 | 2000 ~ 5000 | 12.5
80 x 80 | 12 ~ 48 | 10 ~ 450 | 10
80 x 80 | 24 ~ 80 | 20 ~ 1200 | 16
80 x 80 | 48 ~ 120 | 80 ~ 2000 | 20
80 x 80 | 80 ~ 200 | 200 ~ 3000 | 19
80 x 80 | 120 ~ 250 | 400 ~ 4000 | 21
80 x 80 | 200 ~ 400 | 1200 ~ 6000 | 19
80 x 80 | 250 ~ 600 | 1800 ~ 8000 | 15

Tables — 110V / 220V Super High‑Power Thermal Test Vehicle (TTV)
Voltage (V) | Dimensions (mm) | Selectable Power (W)
110 | 30 x 30 | 80, 260, 1500
110 | 35 x 35 | 130, 550, 2100
110 | 40 x 40 | 150, 400, 2000
110 | 50 x 50 | 250, 500, 2000
110 | 60 x 60 | 360, 740, 1500
110 | 80 x 80 | 320, 660, 2400
220 | 30 x 30 | 320, 1000
220 | 35 x 35 | 540, 2200
220 | 40 x 40 | 600, 1600
220 | 50 x 50 | 1000, 2000
220 | 60 x 60 | 1500, 3000, 6000
220 | 80 x 80 | 1300, 2600, 9600

Technical advantages over single‑zone TTVs

• Reproduces realistic gradients and localized hotspots closer to real silicon
• Independent zone operation for diverse workload scenarios
• High reliability for extreme power densities
• Custom multi‑zone hotspot designs for large‑die simulation

FAQ highlights

• Multi‑Zone vs standard TTV: independent control of power and density per zone versus uniform output
• Standard zone counts: 15 and 25 zones; additional custom layouts available
• Controller & monitoring: full multi‑zone controllers and multi‑point temperature monitoring supported
• Sensor integration: supports T‑type, K‑type thermocouples, RTD and other custom configurations
• Cooling validation: designed for cold plate, liquid, two‑phase, immersion and direct‑to‑chip cooling tests
• Typical lead time: ~6–8 weeks depending on project complexity

Notes
Patent pending. Platform designed and developed by Taiwan‑based KLC Corporation.

Technical specifications

• Model / Platform: KLC TTV 2.0
• Type: Multi‑Zone Power Thermal Test Vehicle (TTV)
• Standard zone configurations: 15‑zone, 25‑zone (custom layouts available)
• Supported dimension range (examples): 30×30 mm up to 80×80 mm (custom sizes on request)
• Supported voltages: 12 V ~ 600 V (examples), and 110 V / 220 V selectable configurations
• Power ranges: examples from a few watts up to multiple kilowatts depending on size and voltage (see tables)
• Power density examples: High Power 150–300 W/cm²; Ultra High Power 500–1,000+ W/cm² (custom)
• Sensors: embedded T‑type thermocouples standard; optional RTD, K‑type and other sensor configurations
• Controller: integrated multi‑zone temperature control and power monitoring system
• Adjustable power: compatible with 110/220 VAC input; adjustable AC output examples shown
• Customization: heating zone layout, power density, voltage configuration, connectors, mounting fixture and application‑specific thermal design
• Lead time (typical): ~6–8 weeks depending on complexity
• Manufacturer: KLC Corporation, Taiwan