High-power electronic load Thin Plate TTV

DC

Overview
The Thin Plate TTV (Thermal Test Vehicle) is a thin-plate thermal load module based on KLC TTV 2.0 designed for repeatable, voltage‑adjustable heat generation for chip- and system-level thermal validation, hotspot analysis and cooling-system benchmarking.

Key capabilities

• Precision adjustable thermal load controlled via input voltage
• Supports low- to high-heat-flux applications and multi-zone configurations
• Safe, repeatable operation using stepwise voltage increases
• Optional integrated temperature sensors for real-time monitoring (NTC, RTD or thermocouple)
• Multiple standard footprints (30×30 to 80×80 mm) and custom dimensions available
• Voltage options: adjustable DC range (examples 12–600 V) or fixed 110 V / 220 V models

Operation and monitoring
The TTV regulates heat output by varying input voltage; compatible with adjustable DC power supplies. For safe, repeatable tests start at low voltage and increase stepwise to the target wattage. When specified, integrated sensors deliver real‑time temperature feedback for control, protection and reliability testing.

Customizable options

• Custom mechanical footprints (standard: 30×30, 35×35, 40×40, 50×50, 60×60, 80×80 mm)
• Target power and power density specification (W/cm²) for high heat‑flux designs
• Fixed or adjustable voltage configurations
• Integrated sensor options: NTC, RTD, thermocouple
• Mounting, interface and layout customization; multi‑zone independent power options
• Application-specific thermal designs (liquid cooling, heat pipe, cold plate, AI server testing)

How to select your TTV

• Define the target power range and operating voltage required for your test case
• Specify footprint size, required power density (W/cm²) and mounting/interface constraints
• Indicate temperature monitoring requirements and preferred sensor type
• Request engineering recommendation: KLC will advise optimal configuration and provide a complete technical specification sheet

FAQ

• Q1: What is a Thin Plate TTV? A precision thermal load module that simulates chip/system heat generation for cooling validation and hotspot testing.
• Q2: How is power controlled? Via input voltage; increase voltage stepwise from a low start to reach the target thermal load safely.
• Q3: What power range is available? From single-digit watts to multi-kW depending on footprint and configuration; up to ~4,200 W reported for 80×80 mm.
• Q4: Can I monitor temperature? Yes — optional integrated sensors provide real-time feedback.
• Q5: What sizes exist? Standard footprints 30×30 to 80×80 mm; custom sizes available on request.
• Q6: Can it be customized? Yes — dimensions, power, power density, voltage type, sensors, mounting and thermal design can be specified.

Available dimension and power configurations (adjustable 12V~600V)
Header: Dimensions (mm) | Adjustable Voltage (V) | Power Range (W) | Maximum Current (A)
30 x 30 | 12 ~ 48 | 5 ~ 280 | 6.0
30 x 30 | 24 ~ 80 | 15 ~ 600 | 8.6
30 x 30 | 48 ~ 120 | 20 ~ 600 | 8.6
30 x 30 | 80 ~ 200 | 50 ~ 600 | 3.6
30 x 30 | 120 ~ 250 | 100 ~ 600 | 3.6
30 x 30 | 200 ~ 400 | 300 ~ 600 | 2.0
30 x 30 | 250 ~ 600 | 450 ~ 600 | 2.0
35 x 35 | 12 ~ 48 | 10 ~ 400 | 8.3
35 x 35 | 24 ~ 80 | 30 ~ 800 | 12.0
35 x 35 | 48 ~ 120 | 30 ~ 800 | 12.0
35 x 35 | 80 ~ 200 | 80 ~ 880 | 4.5
35 x 35 | 120 ~ 250 | 200 ~ 900 | 4.5
35 x 35 | 200 ~ 400 | 500 ~ 900 | 3.2
35 x 35 | 250 ~ 600 | 750 ~ 900 | 3.2
40 x 40 | 12 ~ 48 | 5 ~ 380 | 8.0
40 x 40 | 24 ~ 80 | 20 ~ 1000 | 12.5
40 x 40 | 48 ~ 120 | 80 ~ 1000 | 12.5
40 x 40 | 80 ~ 200 | 80 ~ 1000 | 5.6
40 x 40 | 120 ~ 250 | 200 ~ 1000 | 5.6
40 x 40 | 200 ~ 400 | 500 ~ 1000 | 3.6
40 x 40 | 250 ~ 600 | 800 ~ 1000 | 3.6
50 x 50 | 12 ~ 48 | 10 ~ 380 | 8.0
50 x 50 | 24 ~ 80 | 25 ~ 1050 | 13.3
50 x 50 | 48 ~ 120 | 60 ~ 1600 | 16.6
50 x 50 | 80 ~ 200 | 150 ~ 1600 | 8.0
50 x 50 | 120 ~ 250 | 300 ~ 1600 | 8.0
50 x 50 | 200 ~ 400 | 850 ~ 1800 | 6.0
50 x 50 | 250 ~ 600 | 1300 ~ 2000 | 6.5
60 x 60 | 12 ~ 48 | 10 ~ 280 | 6.0
60 x 60 | 24 ~ 80 | 20 ~ 800 | 10.0
60 x 60 | 48 ~ 120 | 80 ~ 1800 | 15.0
60 x 60 | 80 ~ 200 | 200 ~ 2000 | 11.1
60 x 60 | 120 ~ 250 | 450 ~ 2000 | 8.0
60 x 60 | 200 ~ 400 | 1300 ~ 2400 | 8.7
60 x 60 | 250 ~ 600 | 2000 ~ 2400 | 8.7
80 x 80 | 12 ~ 48 | 10 ~ 450 | 9.6
80 x 80 | 24 ~ 80 | 20 ~ 1200 | 16.0
80 x 80 | 48 ~ 120 | 80 ~ 2200 | 19.7
80 x 80 | 80 ~ 200 | 200 ~ 2200 | 18.2
80 x 80 | 120 ~ 250 | 400 ~ 3450 | 13.1
80 x 80 | 200 ~ 400 | 1200 ~ 4200 | 10.6
80 x 80 | 250 ~ 600 | 1900 ~ 4200 | 10.6

Available fixed-voltage configurations (110 V / 220 V)
Header: Voltage (V) | Dimensions (mm) | Selectable Power (W)
110 | 30 x 30 | 80, 260
110 | 35 x 35 | 130, 550
110 | 40 x 40 | 150, 400
110 | 50 x 50 | 250, 500
110 | 60 x 60 | 360, 740, 1500
110 | 80 x 80 | 320, 660, 2400
220 | 30 x 30 | 320
220 | 35 x 35 | 540
220 | 40 x 40 | 600
220 | 50 x 50 | 1,000
220 | 60 x 60 | 1,500
220 | 80 x 80 | 1,300, 2,600

Notes
Maximum reported output up to approximately 4,200 W for the 80×80 mm configuration. Voltage examples include adjustable DC 12–600 V and fixed 110 V / 220 V models. Integrated temperature sensors are optional and must be specified at inquiry.

Technical specifications

• Manufacturer: KLC Corporation
• Model / series: Thin Plate TTV (based on KLC TTV 2.0)
• Standard footprints: 30×30, 35×35, 40×40, 50×50, 60×60, 80×80 mm (custom sizes available)
• Adjustable voltage range examples: 12–600 V DC
• Fixed-voltage options: 110 V and 220 V models
• Selectable power ranges by configuration (see tables above; max reported ≈ 4,200 W)
• Optional integrated temperature sensors: NTC, RTD or thermocouple
• Applications: chip heat simulation, hotspot testing, GPU/CPU/AI accelerator validation, high-power electronics cooling validation, data center benchmarking, laboratory R&D