DC electronic load TTV

Short description

• Precision adjustable thermal load for chip and system testing
• Supports low to high heat flux applications
• Safe, repeatable operation via stepwise voltage control
• Optional real-time temperature monitoring for accuracy and protection
• Suitable for AI, HPC, GPU, CPU, and data center thermal validation
• Dimensions: 30 × 30, 35 × 35, 40 × 40, 50 × 50, 60 × 60, 80 × 80 mm (custom dimensions available)
• Voltage range: 12–600 V (adjustable) and 110 V / 220 V (fixed-voltage options)
• Max. power output: up to 4,200 W (based on the 80 × 80 mm model)

Product DescriptionKLC’s Thin Plate Thermal Test Vehicle (TTV) series is designed for engineers, R&D teams, and thermal management specialists who need precise, repeatable, and adjustable thermal loading. It is ideal for chip heat simulation and hotspot analysis, CPU/GPU/AI accelerator thermal validation, high-power electronic cooling system testing, data center and server thermal benchmarking, and laboratory/engineering platform applications. The TTV allows users to accurately control the heat load by adjusting input voltage, supporting a wide range of low-power to high-heat-flux scenarios. Compatible with adjustable DC power supplies, it ensures safe stepwise voltage increases to achieve the target thermal load, replicating real-world operating conditions. Optional integrated temperature sensors provide real-time monitoring for temperature control, system stability evaluation, and thermal reliability testing.
Key Features

• Adjustable Power Output — tune input voltage to set the exact heat load for thermal R&D, cooling efficiency assessment, and controlled heat source simulation
• Wide Power Range — supports low-power calibration to high-density heat flux for chip, module, and system validation
• Simple and Safe Operation — start at low voltage and gradually increase to reach stable, repeatable, and safe thermal testing even at high power
• Optional Integrated Temperature Sensor — provides real-time temperature feedback for precise control and thermal reliability monitoring (specify sensor type at inquiry)
• Flexible Size Options — standard footprints from 30 × 30 mm to 80 × 80 mm; custom dimensions available

Customizable Options

• Custom dimensions (30 × 30 mm to 80 × 80 mm or other sizes upon request)
• Target power output
• Required power density (W/cm² or high-heat-flux design)
• Fixed or adjustable voltage configurations
• Integrated temperature sensor options (NTC, RTD, or thermocouple)
• Mounting, interface, and layout customization
• Application-specific thermal design (liquid cooling, heat pipe, cold plate, AI server testing)

How to Select Your TTV

• Determine Target Power Range and Operating Voltage — identify the thermal load and voltage required for your test scenario
• Specify Constraints and Requirements — include footprint size, heat flux, mounting, or sensor requirements
• Temperature Monitoring Needs — specify if integrated temperature sensors are required
• Receive Engineering Recommendation — KLC recommends the best-fit TTV configuration and can provide a complete technical specification sheet

Available Dimension and Power–Voltage ConfigurationsDimensions (mm) | Adjustable Voltage (V) | Power Range (W) | Maximum Current (A)
30 x 30 | 12 ~ 48 | 5 ~ 280 | 6.0
30 x 30 | 24 ~ 80 | 15 ~ 600 | 8.6
30 x 30 | 48 ~ 120 | 20 ~ 600 | 8.6
30 x 30 | 80 ~ 200 | 50 ~ 600 | 3.6
30 x 30 | 120 ~ 250 | 100 ~ 600 | 3.6
30 x 30 | 200 ~ 400 | 300 ~ 600 | 2.0
30 x 30 | 250 ~ 600 | 450 ~ 600 | 2.0
35 x 35 | 12 ~ 48 | 10 ~ 400 | 8.3
35 x 35 | 24 ~ 80 | 30 ~ 800 | 12.0
35 x 35 | 48 ~ 120 | 30 ~ 800 | 12.0
35 x 35 | 80 ~ 200 | 80 ~ 880 | 4.5
35 x 35 | 120 ~ 250 | 200 ~ 900 | 4.5
35 x 35 | 200 ~ 400 | 500 ~ 900 | 3.2
35 x 35 | 250 ~ 600 | 750 ~ 900 | 3.2
40 x 40 | 12 ~ 48 | 5 ~ 380 | 8.0
40 x 40 | 24 ~ 80 | 20 ~ 1000 | 12.5
40 x 40 | 48 ~ 120 | 80 ~ 1000 | 12.5
40 x 40 | 80 ~ 200 | 80 ~ 1000 | 5.6
40 x 40 | 120 ~ 250 | 200 ~ 1000 | 5.6
40 x 40 | 200 ~ 400 | 500 ~ 1000 | 3.6
40 x 40 | 250 ~ 600 | 800 ~ 1000 | 3.6
50 x 50 | 12 ~ 48 | 10 ~ 380 | 8.0
50 x 50 | 24 ~ 80 | 25 ~ 1050 | 13.3
50 x 50 | 48 ~ 120 | 60 ~ 1600 | 16.6
50 x 50 | 80 ~ 200 | 150 ~ 1600 | 8.0
50 x 50 | 120 ~ 250 | 300 ~ 1600 | 8.0
50 x 50 | 200 ~ 400 | 850 ~ 1800 | 6.0
50 x 50 | 250 ~ 600 | 1300 ~ 2000 | 6.5
60 x 60 | 12 ~ 48 | 10 ~ 280 | 6.0
60 x 60 | 24 ~ 80 | 20 ~ 800 | 10.0
60 x 60 | 48 ~ 120 | 80 ~ 1800 | 15.0
60 x 60 | 80 ~ 200 | 200 ~ 2000 | 11.1
60 x 60 | 120 ~ 250 | 450 ~ 2000 | 8.0
60 x 60 | 200 ~ 400 | 1300 ~ 2400 | 8.7
60 x 60 | 250 ~ 600 | 2000 ~ 2400 | 8.7
80 x 80 | 12 ~ 48 | 10 ~ 450 | 9.6
80 x 80 | 24 ~ 80 | 20 ~ 1200 | 16.0
80 x 80 | 48 ~ 120 | 80 ~ 2200 | 19.7
80 x 80 | 80 ~ 200 | 200 ~ 2200 | 18.2
80 x 80 | 120 ~ 250 | 400 ~ 3450 | 13.1
80 x 80 | 200 ~ 400 | 1200 ~ 4200 | 10.6
80 x 80 | 250 ~ 600 | 1900 ~ 4200 | 10.6

110V / 220V selectable models
Voltage (V) | Dimensions (mm) | Selectable Power
110 | 30 x 30 | 80, 260
110 | 35 x 35 | 130, 550
110 | 40 x 40 | 150, 400
110 | 50 x 50 | 250, 500
110 | 60 x 60 | 360, 740, 1500
110 | 80 x 80 | 320, 660, 2400
220 | 30 x 30 | 320
220 | 35 x 35 | 540
220 | 40 x 40 | 600
220 | 50 x 50 | 1,000
220 | 60 x 60 | 1,500
220 | 80 x 80 | 1,300, 2,600

Frequently Asked Questions (FAQ)

• Q1: What is a Thin Plate TTV? A Thin Plate Thermal Test Vehicle (TTV) is a precision thermal load module that simulates chip or system-level heat generation for cooling system validation, hotspot testing, and thermal reliability assessment.
• Q2: How do I control the power output? The TTV’s heat output is adjustable via input voltage. Start at low voltage and gradually increase to reach the target thermal load safely.
• Q3: What is the power range of the Thin Plate TTV? The TTV supports low-power to high-density heat flux applications across a wide range of configurations; custom power ranges are available upon request.
• Q4: Can I monitor the temperature during testing? Yes. Optional integrated temperature sensors provide real-time thermal feedback for precise control and system safety.
• Q5: What sizes are available? Standard sizes range from 30 × 30 mm up to 80 × 80 mm; custom dimensions can be designed to match specific chips or localized heat sources.
• Q6: Can the TTV be customized? Yes. KLC offers full customization including dimensions, target power, power density, voltage type, sensor options, mounting interfaces, and application-specific thermal design.
• Q7: How do I select the right TTV for my project? Identify the target power range, operating voltage, and thermal requirements and specify if temperature monitoring is needed; engineering recommendations and specification sheets are provided.
• Q8: Which applications are ideal for the Thin Plate TTV? AI accelerators, CPU and GPU thermal testing, data center cooling performance validation, high-power electronics heat management, laboratory thermal simulations, and heat sink / cold plate testing.

Caractéristiques / spécifications techniques

• Brand: KLC (KLC Corporation)
• Model / series: Thin Plate TTV
• Standard footprints: 30 × 30 mm, 35 × 35 mm, 40 × 40 mm, 50 × 50 mm, 60 × 60 mm, 80 × 80 mm (custom sizes available)
• Adjustable voltage range: 12–600 V (for adjustable DC configurations)
• Fixed-voltage options: 110 V and 220 V models with selectable power options
• Maximum power: up to 4,200 W (based on 80 × 80 mm configurations)
• Power ranges: configuration-dependent (see full dimension/power listings above)
• Maximum current: configuration-dependent (values listed per configuration above)
• Optional integrated temperature sensors: NTC, RTD, or thermocouple
• Compatible with adjustable DC power supplies; supports safe stepwise voltage increases for repeatable testing
• Applications: chip heat simulation, hotspot analysis, CPU/GPU/AI thermal validation, data center/server benchmarking, cooling system evaluation