DC electronic load TTV 2.0

Product Overview
KLC TTV 2.0 is a modular thermal test vehicle (TTV) designed to simulate localized heat loads for Open Accelerator Modules (OAM) used in AI GPUs, DPUs and CPUs. The platform reproduces heat fluxes up to 500 W/cm² and supports testing with liquid cooling, immersion, cold plates, heatsinks and Cooling Distribution Units (CDU). Standard footprints: 30 × 30 mm to 80 × 80 mm. Input range: 12–600 V; platform total power up to 12,800 W (higher custom totals available).

Key Features

• Adjustable power output via input voltage to match target heat loads.
• Wide power range: from a few watts to multi-kW per unit; platform configurations to 12,800 W.
• High power density: capable of reproducing hotspots up to 500 W/cm².
• Compatible with liquid cooling, immersion, cold plates, heatsinks and CDU testing.
• Optional integrated temperature sensor(s) for real‑time thermal feedback.
• Multiple standard footprints (30×30 to 80×80 mm); custom dimensions available.

Customizable Options

• Custom footprints and multi‑zone layouts (e.g., independent zone control).
• Target power ratings and required power density (W/cm²).
• Fixed-voltage (110 V / 220 V) or adjustable 12–600 V designs.
• Integrated temperature sensors and telemetry interfaces.
• Mechanical mounting, interface holes and form‑factor adaptations.

How to Select Your TTV

• Define the target power range (W) and operating voltage (V) for your test case.
• Specify the cooling interface to be validated (air, liquid, immersion, cold plate, CDU or OAM architecture).
• Indicate if temperature monitoring is required and the number of independent zones.
• Provide mechanical constraints (footprint, mounting, allowable contact pressure) for correct mechanical integration.

Available Power–Voltage Configurations (summary)
Selected examples from platform tables showing footprint, adjustable voltage range, power range and indicative max current per configuration:
30 × 30 mm | 12–600 V | examples to 2,000 W per unit
35 × 35 mm | 12–600 V | examples to 2,500 W per unit
40 × 40 mm | 12–600 V | examples to 3,200 W per unit
50 × 50 mm | 12–600 V | examples to 5,000 W per unit
60 × 60 mm | 12–600 V | examples to 5,000 W per unit
80 × 80 mm | 12–600 V | examples to 8,000 W per unit


Applications & Use Cases

• Thermal validation of OAM accelerator modules for AI GPUs, DPUs and servers.
• Cold‑plate and CDU development, heatsink evaluation and immersion cabinet testing.
• Board‑level evaluation on UBB (Universal Baseboard) and system integration testing.
• R&D and production test benches that replace expensive silicon for thermal verification.

Safety & Installation Notes

• Resistive heating element — the TTV does not self‑regulate (not PTC); external temperature control and over‑current protection required.
• Recommended minimum contact pressure ~65 psi for thermal interface; mechanical design withstands high total clamping loads (design targets shown).
• Do not operate without active cooling (no dry burning) — immediate device failure will occur.

Technical Specifications (selection)

• Brand: KLC Corporation (KLC TTV 2.0 platform)
• Standard footprints: 30 × 30 mm to 80 × 80 mm (custom on request)
• Adjustable voltage range: 12–600 V (fixed 110/220 V options available)
• Power per unit: selectable from single‑digit watts up to multi‑kW (examples in tables); platform totals to 12,800 W
• Maximum power density: up to 500 W/cm² (on request)
• Cooling interfaces: liquid, immersion, cold plate, heatsink, CDU
• Optional features: integrated temperature sensors, multi‑zone control, mechanical/mounting customizations