Performance test module KLC TTV 2.0

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Short summary
The KLC TTV 2.0 Thermal Test Vehicle (TTV) is a heat‑simulation module for AI accelerators and high‑power server components. It reproduces localized heat loads up to 500 W/cm², supports footprints from 30×30 mm to 80×80 mm, and operates with adjustable input voltages (typical 12–600 V). Configurations enable per‑unit power up to several kilowatts and platform totals up to 12,800 W.

Product overview
The KLC TTV 2.0 is engineered for thermal validation of AI servers, GPU/DPU OAM modules and high‑performance electronics. It provides precise, adjustable resistive heating to emulate hotspots and bulk thermal loads without using functional silicon. The module integrates with liquid cooling, immersion systems, cold plates, heatsinks and CDU test setups to validate cooling performance, thermal interface materials and mechanical mounting strategies.

Key features

• Adjustable power output: select target heat load by tuning input voltage or selecting fixed‑voltage variants.
• Wide power range: per‑unit examples from hundreds of watts to several kilowatts; platform capability to ~12,800 W in supported configurations.
• High power density simulation: available designs to reproduce up to 500 W/cm² for hotspot emulation.
• Cooling compatibility: supports liquid cooling, immersion cooling, cold plates, heatsinks and CDU testing.
• Size flexibility: standard footprints 30×30 to 80×80 mm; custom sizes and multi‑zone layouts on request.
• Optional sensors: integrated temperature sensor options for real‑time monitoring and safety integration.
• Safe operation practice: resistive heating requires external temperature control and over‑current protection; avoid powering without active cooling.

Primary specification table
Dimensions A × B (mm) | Adjustable Voltage (V) | Max Current (A) | Max. Power (W)
30 × 30 | 12–600 | 15.0 | 2000
35 × 35 | 12–600 | 21.0 | 2500
40 × 40 | 12–600 | 14.0 | 3200
50 × 50 | 12–600 | 10.4 | 5000
60 × 60 | 12–600 | 12.5 | 5000
80 × 80 | 12–600 | 50.6 | 8000

Customizable options

• Custom footprints and multi‑zone arrangements (independent power zones).
• Specified power ratings and target power density (W/cm²).
• Fixed mains variants (110 V / 220 V) or adjustable DC input (12–600 V).
• Integrated temperature sensors, telemetry and connector/interface options.
• Application‑specific mechanical form factor, mounting holes and pressure specifications.

How to select your TTV

• Define the required per‑unit and aggregate power (W) and operating voltage (V) for your test case.
• Specify the cooling interface (air, liquid, immersion, cold plate or OAM architecture).
• Indicate required sensor/monitoring capabilities and number of independent zones.
• Provide mechanical constraints (footprint, mounting, allowable contact pressure) to enable correct integration.

Available power–voltage configurations (examples)
Typical designs cover 12 V–600 V adjustable input with representative per‑size power examples shown in the primary table. Fixed 110 V / 220 V variants are available with selectable power points per footprint (examples provided in technical documentation).

Technical specifications (summary)

• Heating principle: resistive heating element (not self‑regulating PTC).
• Max power density: up to 500 W/cm² (design dependent).
• Voltage range: typical 12 V–600 V; fixed 110 V/220 V options available.
• Standard footprints: 30×30, 35×35, 40×40, 50×50, 60×60, 80×80 mm; custom sizes on request.
• Total simulated power capability: examples up to 12,800 W in supported platform configurations.
• Cooling compatibility: liquid, immersion, cold plates, heatsinks, CDU.
• Monitoring: optional integrated temperature sensors and multi‑zone control.

Application scenarios

• OAM modules for AI GPUs — hotspot emulation and stability testing.
• AI servers and DPU platforms — validate cooling reliability under realistic loads.
• Cold plate and heatsink development — optimize designs and coolant distribution.
• UBB and board‑level testing — evaluate layout and thermal conduction.
• Immersion cabinet and CDU testing — assess cabinet‑level thermal removal and flow.

Safety & installation notes

• The TTV uses resistive heating and has no intrinsic temperature self‑regulation; external temperature controllers and over‑current protection are required.
• Mounting requires secure fixation and uniform contact pressure; recommended minimum contact pressure and mechanical fastening provisions are provided in product documentation.
• Operation without active cooling (dry burning) is strictly prohibited and will damage the module.

R&D & validation notes
Examples from industry studies show resistive TTV platforms are effective for validating high‑heat‑flux cooling approaches (including dual‑phase and immersion systems). The modular platform scales to demanding AI datacenter validation tasks.

Benefits

• Enables thermal validation without using expensive functional processors.
• Speeds R&D cycles by allowing early thermal testing and cooling optimization.
• Provides reproducible, configurable heat loads for benchmark and system validation.