Product overviewThe batch soldering system with microprocessor control for laboratory work and small-scale production. Designed for easy handling and fast programming of individual soldering profiles, it minimises setup time. The MRO250 processes printed circuit boards up to 350 × 250 mm and features a compact, low-weight, transportable design.
Technical specifications- Dimensions: 590 × 430 × 305 mm
- Max. PCB size: 350 × 250 mm
- Preheating temperature / time: 50 – 240 °C / 1 – 3600 s
- Reflow temperature / time: 75 – 320 °C / 1 – 600 s
- Long-time process (e.g. adhesive cure): 50 – 180 °C / 1 – 300 min
Key features- Microprocessor control suitable for laboratory and small-batch production
- User-friendly interface for quick programming of individual profiles
- Processes PCBs up to 350 × 250 mm
- Compact, low-weight and easily transportable
- Wide preheating, reflow and long-time process ranges
Applications and resources- Typical applications: prototyping, R&D, small-scale PCB assembly
- Available product page sections: Details, Software, Product video