Conveyor oven IRO850

chamberhot airair circulating

Product information
FRITSCH's inline reflow soldering system IRO850 is designed for small to medium series PCB assembly. The oven supports lead-free (RoHS) hot-air convection reflow and is compatible with a wide variety of components including QFP, BGA and CSP. The active chamber length is up to 850 mm and the usable pin-chain width ranges from 35 to 395 mm. Conveyor infeed height is approximately 45 mm and process profiles are managed via configurable, user-friendly software.

Technical specifications

• Usable width of pin chain: 35 - 395 mm
• Active chamber length: 850 mm
• Infeed height: approx. 45 mm
• Conveyor speed: 3 – 70 cm/min
• Process type: hot-air convection reflow

Applications and benefits

• Inline integration for automated production lines and assembly workflows
• Suitable for prototyping and small to medium series manufacturing
• Supports diverse PCB component types (QFP, BGA, CSP)
• Programmable thermal profiles and software control for repeatability
• Designed for lead-free production in compliance with environmental standards