Cleaning solvent

for etching residues

Overview
Aqueous post-etch cleaners formulated to remove etch residues from aluminum, copper and advanced metal alloys, anti-reflective coatings, SiO2 and ultra low-k dielectrics. Designed for integration in BEOL (back end of line) semiconductor processes and compatible with common spray and batch tool platforms. Manufacturing and purity verification are performed in US and Asia facilities.

Applications

• Removal of post-etch residues
• Cleaning of Al and Cu metallization and advanced metal alloys
• Cleaning of anti-reflective coatings (ARC), SiO2 and ultra low-k dielectric materials
• Integration in BEOL process flows (spray and batch tool compatibility)

Key information

• Chemistry type: aqueous
• Primary application: post-etch cleaning and drying
• Process compatibility: BEOL (back end of line) semiconductor processes
• Compatible materials: Al (aluminum), Cu (copper), advanced metal alloys, anti-reflective layers, SiO2, ultra low-k dielectrics
• Tool compatibility: spray and batch tools
• Rinse: compatible with direct ultrapure water rinse (reduces need for solvent rinses)
• Product variants: grades available by etch type; options with or without surfactant
• Packaging: 4L bottles ×4, 200L drums (one-way or returnable), 1000L totes (one-way or returnable), bulk supply (where available)
• Manufacturer: FUJIFILM — manufactured and quality-verified in US and Asia

Technical specifications

• Chemistry: water-based formulation (specific composition varies by grade)
• Typical uses: post-etch residue removal, pre-clean prior to metallization or dielectric deposition, drying support
• Material compatibility: Al, Cu, advanced alloys, ARC, SiO2, ultra low-k
• Process integration: suitable for spray and batch BEOL toolsets
• Supply and packaging options as listed above
• Quality control: routine purity verification using advanced analytical methods