Cleaning solvent

for electronicsfor etching residues

Etchants A comprehensive range of specialty and proprietary etchant blends We offer a broad range of diluted Hydrofluoric (HF) ratios, specialty Buffered Oxide Etchants (BOE) - with/without surfactant, Mixed Acid etchants (MAE) & specialty metal etchants Product Summary • Buffered Oxide Etchants • Fujifilm has advanced capabilities for the precise blending of Buffered Etchants with tight assay specification ranges, available in multiple NH4F:HF ratios • Utilized to etch SiO2 films • Utilized as pre-diffusion and pre-metallization surface preparations • Formulated from high purity 49% Hydrofluoric Acid and high purity 40% Ammonium Fluoride • Available with and without surfactant • Dilute HF • Fujifilm has advanced capabilities for the precise blending of dilute HF with tight assay specification ranges • Freckle Etch • For the removal of residual silicon nodules left after etching aluminum-silicon-copper layers • Mixed Acid Etchants • For the isotropic etching of silicon (mono and poly-crystalline) • Specialty Pad Etchants • Used to etch deposited pyro lytic and sputtered final passivation glasses in order to expose semiconductor bonding pads for wire bonding • Available with and without our OHS surfactant • Specialty Metal Etchants For the selective removal of specific metal layers Fujifilm offers various specialty etchants, including • Specialty Aluminum Etchants: Immersion etchants for aluminum metallization layers - Available with or without the Fujifilm Aluminum Etch Surfactant (AES) • Chrome Etch: a specialty blend for the patterning of Chromium layers