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E-ATX motherboard MW94-RP0
Intel® XeonIntel®DDR5 UDIMM

E-ATX motherboard - MW94-RP0 - GIGABYTE G.B.T Technology Trading GmbH - Intel® Xeon / Intel® / DDR5 UDIMM
E-ATX motherboard - MW94-RP0 - GIGABYTE G.B.T Technology Trading GmbH - Intel® Xeon / Intel® / DDR5 UDIMM
E-ATX motherboard - MW94-RP0 - GIGABYTE G.B.T Technology Trading GmbH - Intel® Xeon / Intel® / DDR5 UDIMM - image - 2
E-ATX motherboard - MW94-RP0 - GIGABYTE G.B.T Technology Trading GmbH - Intel® Xeon / Intel® / DDR5 UDIMM - image - 3
E-ATX motherboard - MW94-RP0 - GIGABYTE G.B.T Technology Trading GmbH - Intel® Xeon / Intel® / DDR5 UDIMM - image - 4
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Characteristics

Format
E-ATX
Processor
Intel® Xeon
Chipset
Intel®
Memory
DDR5 UDIMM
Extension slot
M.2, PCI Express, 4 PCIe x16, 2 PCIe x8
Applications
industrial, workstation
Memory frequency
DDR5 4800 MHz, DDR5 5600 MHz
Connectivity
gigabit Ethernet, USB 3.2, USB Type-C, VGA, RJ45, RS-232

Description

Product summary
  • Single Intel® Xeon® 600 Processors for Workstations
  • 8-Channel DDR5 RDIMM/MRDIMM, 8 x DIMMs
  • 2 x 10Gb/s LAN ports via Intel® X710-AT2
  • 2 x MCIO 8i connectors with PCIe Gen5 x8 interface (requires Intel® Xeon® 690/670/650 processors)
  • 1 x SlimSAS 8i connector with PCIe Gen4 x8 interface
  • 2 x SlimSAS 4i connectors with SATA interface (8 x SATAIII)
  • 4 x M.2 slots with PCIe Gen5 x4 interface
  • Multiple PCIe Gen5 x16 expansion slots (see PCIe Expansion Slots specification)

Ordering numbers
Retail: 9MW94RP0MR-000-1*
Bulk: 9MW94RP0NR-000-1*

Highlights
  • Designed for modern workstation workloads with high core density, AI acceleration and platform bandwidth
  • Supports Intel® Xeon® 600 processors for workstations (Redwood Cove+ P-core architecture)
  • Expanded PCIe 5.0 connectivity and faster DDR5 memory with W890 workstation chipset
  • Flexible I/O and storage: multiple NVMe M.2, MCIO and SlimSAS connectors plus abundant PCIe expansion

Platform comparison (selected Xeon 600 workstation SKUs)
Header | Intel® Xeon® 690 Processors | Intel® Xeon® 670 Processors | Intel® Xeon® 650 Processors | Intel® Xeon® 630 Processors
Chipset | Intel® W890 Chipset | Intel® W890 Chipset | Intel® W890 Chipset | Intel® W890 Chipset
Core Count | 64 to 86 cores | 28 to 48 cores | 18 to 24 cores | 12 to 16 cores
Memory Channel | 8 channels (colspan) | 8 channels (colspan) | 8 channels (colspan) | 4 channels
DDR5 RDIMM/3DS-RDIMM | 1DPC @ 6400 MT/s or 2DPC @ 5200 MT/s (applies across listed SKUs)
MRDIMM Support | 1DPC @ 8000 MT/s (select SKUs) | 1DPC @ 8000 MT/s (select SKUs) | 1DPC @ 8000 MT/s (select SKUs) | N/A
Memory Capacity | Up to 4 TB (select configurations) | Up to 4 TB (8 channels) / Up to 2 TB (4 channels) | Up to 4 TB (with 8 channels) | Up to 2 TB (4 channels)
PCIe 5.0 Lanes | Up to 128 lanes (higher-end SKUs) | Up to 128 lanes (higher-end SKUs) | Up to 128 lanes (higher-end SKUs) | Up to 80 lanes (example)
TDP | Up to 350W | Up to 300W | Up to 250W | Up to 180W

GPU / Accelerator support
  • Supports up to 4 x dual-slot accelerators (multi-GPU configurations)
  • Up to 128 CPU PCIe 5.0 lanes (depending on CPU SKU) for flexible multi-GPU and accelerator setups

Multiple storage interfaces
  • 4 x NVMe M.2 (2280/22110) slots – PCIe Gen5 x4 (from CPU)
  • 2 x MCIO 8i ports – 4 x Gen5 NVMe (from CPU) (requires Intel® Xeon® 690/670/650 processors)
  • 1 x SlimSAS 8i – 2 x Gen4 NVMe (from PCH)
  • 2 x SlimSAS 4i – 8 x SATAIII (from PCH)

Connectivity
  • Dual Intel® X710-AT2 10GbE LAN (supports NCSI)
  • 1 x 10/100/1000 Mbps Management LAN

Hardware security
  • Optional TPM 2.0 module support via TPM header (SPI interface)
  • Support for hardware-based authentication (passwords, encryption keys, certificates stored in TPM module)

Management & software
  • ASPEED® AST2600 Baseboard Management Controller (BMC)
  • GIGABYTE Management Console web interface for real-time health monitoring and maintenance
  • GIGABYTE Server Management (GSM) suite: GSM Server, GSM CLI, GSM Agent, GSM Mobile and GSM Plugin (supports IPMI and Redfish)

BIOS / Firmware & downloads
  • Multiple BIOS versions available (e.g. F03, F02) with release dates and BIOS update packages provided via support download section

Notes & disclaimers
  • Feature availability may vary depending on the selected CPU SKU; certain features (MCIO 8i ports, Slot_2/6 full functionality, MRDIMM support) require Intel® Xeon® 690/670/650 processors or specific SKUs
  • Advertised performance values are theoretical and depend on configuration

Caractéristiques / spécifications techniques
  • Form Factor (WxD, mm): E-ATX — 304.8 x 330.2
  • CPU: Intel® Xeon® 600 processors for workstations — single processor, TDP up to 350W (select SKUs); note: select functions require Intel® Xeon® 690/670/650 processors
  • Socket: 1 x LGA 4710-2 (Socket E2)
  • Chipset: Intel® W890
  • Memory: 8 x DIMM slots; supports DDR5 RDIMM / MRDIMM; 8-channel memory per processor; RDIMM up to 6400 MT/s; MRDIMM up to 8000 MT/s (MRDIMM supported on select SKUs). Note: only 4 x DIMMs supported with Intel® Xeon® 630 processors.
  • LAN: 2 x 10Gb/s LAN (Intel® X710-AT2) with NCSI support; 1 x 10/100/1000 Mbps Management LAN
  • Video: Integrated in ASPEED® AST2600 — 1 x VGA port
  • Audio: Realtek® ALC897 HD Audio Codec; supports 2/4/5.1/7.1; 3 x audio jacks (Audio in/Audio out/Mic)
  • Storage Interface: 2 x MCIO 8i (4 x Gen5 NVMe from CPU) — requires Intel® Xeon® 690/670/650 processors; 1 x SlimSAS 8i (2 x Gen4 NVMe from PCH); 2 x SlimSAS 4i (8 x SATA from PCH); 4 x M.2 (2280/22110) PCIe Gen5 x4 (from CPU)
  • RAID: Intel® SATA RAID 0/1/10/5; onboard VROC key header
  • PCIe Expansion Slots: Multiple PCIe Gen5 x16 slots routed from CPU (Slot_1/2/3/5/6/7 layout); Slot_2 and Slot_6 require Intel® Xeon® 690/670/650 processors for full functionality; 2 x MCIO 8i connectors (Gen5 x8 each)
  • Internal I/O: 1 x 24-pin ATX main power; 2 x 8-pin ATX 12V; 1 x 4-pin power (for PCIe slots); CPU fan header; 6 system fan headers; front audio; USB 3.2 Gen2x2 header (Type-E); USB 3.2 Gen1 x2 header; 4 x M.2 slots; 2 x MCIO 8i; 1 x SlimSAS 8i; 2 x SlimSAS 4i; VROC connector; front panel header; backplane board header; PMBus header; IPMB header; TPM header
  • Rear I/O: 1 x USB 3.2 Gen2x2 (Type-C); 3 x USB 3.2 Gen2 (Type-A); 1 x VGA; 1 x Serial; 2 x RJ45 LAN; 1 x MLAN; 3 x Audio jacks; 1 x ID button with LED
  • Security Modules: 1 x TPM header (SPI) — optional TPM2.0 kit (part number CTM012)
  • Board Management: ASPEED® AST2600 BMC; GIGABYTE Management Console
  • PSU Connectors: 1 x 24-pin ATX; 2 x 8-pin ATX 12V; 1 x 4-pin PCIe auxiliary power
  • Operating Properties: Operating temp 10°C to 40°C; operating humidity 8% to 80% non-condensing; non-operating temp -40°C to 60°C; non-operating humidity 20% to 95% non-condensing
  • Retail packaging: 1 x MW94-RP0; 1 x I/O shield; 2 x carriers; 4 x M.2 heatsinks; 1 x SlimSAS 4i to 4 x SATA cable (600mm). Single box dims: 409 x 355 x 78 mm; carton dims: 729 x 415 x 432 mm; quantity: 10 single boxes per carton
  • Bulk packaging: 10 x MW94-RP0; 10 x I/O shields. Carton dims: 600 x 473 x 495 mm
  • Reference / Part Numbers: Retail 9MW94RP0MR-000-1*; Bulk 9MW94RP0NR-000-1*; I/O shield: 12AIO-MW83RP-00R; M.2 heatsink: 12SP2-11000E-00GR; SlimSAS 4i to 4 x SATA cable (600mm): 25CFM-600700-A4R
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.