PVD deposition machine LTMC
CVDvacuum

PVD deposition machine - LTMC - GUANGDONG HUASHENG - CVD / vacuum
PVD deposition machine - LTMC - GUANGDONG HUASHENG - CVD / vacuum
PVD deposition machine - LTMC - GUANGDONG HUASHENG - CVD / vacuum - image - 2
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Characteristics

Method
PVD, CVD
Other characteristics
vacuum

Description

Overview
LTMC equipment performs low temperature plasma chemical vapor deposition (PCVD) to create a metal-ceramic diffusion layer on metal components. Under vacuum and below 150°C, plasma activates silicon-, boron- and nitrogen-containing process gases which react with and diffuse into the substrate surface, forming a graded composite ceramic layer that increases surface hardness and provides solid-lubricating phases.

Key performance summary
  • Chamber volume: 3.4 m³
  • Effective treatment area: 1,200 × 1,100 × 550 mm
  • Maximum loading weight: 3,000 kg
  • Typical process time: 3–5 hours (depends on workpiece and process parameters)
  • Operating / maximum working temperature: below 150°C

Key benefits of LTMC technology
  • Low-temperature surface hardening: raises surface hardness while limiting thermal effects on substrate, suitable for thin-walled and precision parts.
  • Ceramic diffusion bonding: Si, B and N form ceramic phases that diffuse to depths of ~10–20 μm, producing a graded, strongly bonded wear-resistant layer.
  • Self-lubricating surface: formation of phases such as hexagonal boron nitride provides solid lubrication to reduce friction while retaining hardness.
  • Internal and external surface treatment: adjustable electrode shapes enable treatment of internal walls and thin-walled components.

Applications and compatible materials
  • Typical applications: cylinder liners, piston rings, cutting tools, molds, camshafts, rocker arms, bearings, gears and similar components requiring wear resistance and low friction.
  • Treatable materials: steels, titanium alloys, aluminum alloys, cemented carbide (examples tested: 20CrNiMo, TC17, YG6, pure copper).

Process and functional details
LTMC uses low-temperature PCVD: plasma activates reactive gases (Si-, B- and N-containing), forming ceramic phases that diffuse into the near-surface region to depths of 10–20 μm, creating a graded composite layer with wear-resistant and self-lubricating properties.

Product parameters
Equipment: LTMC Low Temperature Metal Ceramic Coating Equipment
Process technology: Low Temperature Plasma Chemical Vapor Deposition (PCVD)
Chamber volume: 3.4 m³
Effective treatment area: 1,200 × 1,100 × 550 mm
Maximum loading weight: 3,000 kg
Equipment dimensions (L × W × H): 8,770 × 5,100 × 2,320 mm
Ceramic-forming elements: silicon, boron, nitrogen
Process gases: N2 / SiH4 / B2H6
Ceramic diffusion depth: 10–20 μm
Gas control modes: chamber pressure control or gas flow control
Vacuum pump configuration: rotary vane pump + Roots pump
Pumping speed: 1,200 m³/h
Typical process time: 3–5 hours
Operating temperature: below 150°C

Selected FAQ highlights
  • What is LTMC equipment used for? — Low-temperature metal-ceramic diffusion treatment to improve surface hardness, wear resistance and self-lubricating performance for components such as cylinder liners, bearings, gears, cutting tools and molds.
  • What is the treatment temperature? — Below 150°C (maximum working temperature 150°C).
  • What materials can be treated? — Steel, titanium alloys, aluminum alloys, cemented carbide (examples tested: 20CrNiMo, TC17, YG6, pure copper).
  • Can internal walls and thin-walled parts be treated? — Yes. Electrode shapes can be adjusted for internal-wall and thin-walled component treatment (e.g., 1.5 mm thin-walled liners).
  • What is the maximum loading capacity? — 3,000 kg; effective treatment area 1,200 × 1,100 × 550 mm; chamber volume 3.4 m³.

Technical specifications
  • Series / name: LTMC
  • Process: Low Temperature Plasma Chemical Vapor Deposition (PCVD)
  • Chamber volume: 3.4 m³
  • Effective treatment area: 1,200 × 1,100 × 550 mm
  • Maximum loading weight: 3,000 kg
  • Equipment dimensions: 8,770 × 5,100 × 2,320 mm
  • Operating temperature: below 150°C
  • Typical cycle time: 3–5 hours (depends on part and settings)
  • Ceramic-forming elements: silicon, boron, nitrogen
  • Process gases (examples): N2 / SiH4 / B2H6
  • Ceramic diffusion depth: 10–20 μm
  • Gas control: chamber pressure control or gas flow control
  • Vacuum system: rotary vane pump + Roots pump
  • Pumping speed: 1,200 m³/h
  • Treatable materials: steel, titanium alloys, aluminum alloys, cemented carbide
  • Capabilities: internal and external surface treatment, thin-walled component processing, adjustable electrode shapes

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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