Spray cleaning system

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TESTEQ Thermal Vacuum Cleaning System for High-Precision Semiconductor Components Industry-Leading Contamination Removal for Lithography, Optics & Wafer Processing This equipment adopts an innovative inclined sealing structure (patented design-Thermal Vacuum/Lithography/UHV). Through the gravity-adaptive cover plate and double-ring sealing ring interlocking technology, it can maintain a stable vacuum level (≤10⁻⁶ Pa), solving the problem of reduced cleaning efficiency caused by sealing failure in traditional equipment. It integrates a dual-fluid spray system (sodium hydroxide + deionized water), supporting non-destructive cleaning in a high-temperature (350℃) vacuum environment, avoiding thermal stress deformation. It is suitable for the maintenance of high-precision components such as mask plates, lens groups, and vacuum pump components of lithography machines, significantly improving chip yield and equipment lifespan. A fully automatic thermal vacuum cleaning equipment specially designed for components of lithography machines and mask plates. Through a high-temperature and low-pressure environment and non-contact dry cleaning technology, it can thoroughly remove nano-level contaminants (such as organic residues and particles), meeting the strict requirements for ultra-clean surfaces in semiconductor manufacturing, flat panel display, and integrated circuit fields. It supports multi-scenario cleaning of wafers, optical lenses, vacuum chambers, etc. Technical Specifications ✔ Vacuum Range: 10⁻³ to 10⁻⁷ Pa (configurable for EUV, DUV, and advanced packaging) ✔ Temperature Range: 150°C to 450°C (precision-controlled for optics, metals, and coatings) ✔ Gas Purging System: N₂, Ar, H₂, or custom mixes (0.1–0.5 MPa, pulsed/continuous flow) ✔ Plasma-Assisted Cleaning (Optional): O₂, Ar plasma (50–300W) for organic/polymer removal ✔ Ultrasonic Enhancement (Optional): 40–80 kHz for particle dislodgement (low-pressure safe) ✔ Material Compatibility: Si/Mo mirrors, SiC, Al (≤200°C), stainless steel, ceramics ✔ Process Monitoring: Real-time RGA (Residual Gas Analysis) & particle detection Critical Applications 1. EUV Lithography Systems Mirror & Collector Optics Cleaning – Eliminates Sn droplets and carbon buildup. Reticle & Pellicle Maintenance – Ensures zero mask defects. Vacuum Chamber Conditioning – Prevents contamination in EUV source modules. 2. DUV Lithography & Advanced Packaging Lens & Prism Decontamination – Stops haze formation. Wafer Chuck & Stage Recovery – Restores optimal electrostatic clamping. 3. R&D & Failure Analysis Prototype Surface Prep – Clean surfaces for SEM, TEM, XPS analysis.