The thermal shock test chamber is applicable to industries such as electrical and electronic products, automotive parts, and plastics, and meets multiple standards including CNS, MIL, IEC, JIS, and GB/T2423. For instance, in the electronics industry, it can verify the performance stability of chips and displays under sudden temperature changes, and in the automotive field, it can test the environmental adaptability of sensors and wiring harnesses.
Technical Specifications
Capacity : 70 to 300L
Temperature Range: -65℃ to +150℃
Heating Rate: +60°C to +200°C ≤ 20min
Cooling Rate: From +20°C to -75°C ≤ 70min
Heating Time RT~200°C / About 30mins
Cooling Time RT~75°C / About 30mins
Features :
1. Divided into a high-temperature zone, low-temperature zone, and test zone. The test product is placed in the test zone, and the temperature from the high-temperature zone or low-temperature zone is applied to the test zone for thermal shock. The test product remains static during the test.
2. Equiped with a touch-screen control interface for easy operation.
3. Temperature is transferred to the test zone using a wind route switching method to perform thermal shock testing.
4. The maximum duration of high-temperature or low-temperature shock can reach 999 hours, and the maximum cycle period can reach 9999 cycles.
5. The system can operate in automatic cycle mode or manually select specific shocks. It can be set to perform two-zone or three-zone shocks, as well as cold-to-hot or hot-to-cold transitions.
6. The cooling system utilizes a dual refrigeration system, providing fast cooling. Water cooling is employed as the cooling method.
7. Testing can be performed at room temperature.
Meet standard:
GJB150.5A-2009 Temperature shock test
GB/2424.13-2002 Temperature shock test
GJB360B-2009 Temperature shock test
GB2423.1-2008/IEC6008-2-1-2007 Low-temperature test methods
GB2423.2-2008 High-temperature test methods
GBT 10589-2008 Technical conditions for low-temperature test chambers
GBT 11158-2008 Technical conditions and specifications for high-temperature test chambers