UV laser marking machine EP-15-THG-S

for siliconfor plasticsfor metal

Product Name Single-station UV Laser Marking Machine (Model: EP-15-THG-S).

Machine Features

• Cold laser processing with minimal heat-affected zone to reduce thermal damage
• Compatible with a wide range of materials (metals, plastics, coatings)
• High beam quality and small focal spot enabling superfine marking (minimum line width 10–15 µm)
• High marking speed up to 250 characters/sec for efficient throughput
• No consumables; low operating and maintenance costs
• Stable performance suitable for continuous industrial operation
• Micro-hole drilling capability, diameter ≤ 10 µm

Applications

• Marking of logos, model numbers and origin on electronic components and devices
• Marking and drilling on food packaging, PVC pipes and medical packaging materials (HDPE, PO, PP)
• PCB marking and cutting; removal of metallic or non-metallic coatings
• Silicon wafer micro-hole and blind-hole processing; marking on low-voltage equipment

Technical Data Sheet
Machine model: EP-15/25/30-THG-S
Laser wavelength: 355 nm
Laser power: 4 W / 7 W / 10 W / 15 W / 25 W
Minimum marking line width: 10 µm – 15 µm
Marking speed: up to 250 characters/sec
Marking area: 100 × 100 mm (standard lens F160)
Pulse repetition frequency: 10–200 kHz
Cooling mode: Water cooling
Power supply: AC 220 V, 50 Hz, 16 A
Total power consumption: ≤ 1.5 kW
Overall dimensions (W × D × H): 800 × 950 × 1630 mm

Characteristics / Technical specifications

• Machine model: EP-15/25/30-THG-S
• Laser wavelength: 355 nm
• Laser power options: 4 W, 7 W, 10 W, 15 W, 25 W
• Minimum marking line width: 10 µm – 15 µm
• Marking speed: up to 250 characters/sec
• Marking area: 100 × 100 mm (standard F160)
• Pulse repetition frequency: 10–200 kHz
• Cooling: Water cooling
• Power supply: AC 220 V, 50 Hz, 16 A
• Total power consumption: ≤ 1.5 kW
• Overall dimensions (W × D × H): 800 × 950 × 1630 mm