UV laser marking machine EP-15-THG-D

metalfor siliconfor paper

Machine Features

• Dual-station rotary worktable: one station for loading/unloading and the other for marking to maximize throughput for batch production.
• Equipped with safety light curtain to enable safe, continuous operation.
• Compatible with multiple laser sources: UV (355 nm), green (SHG), IR and others; available models include EP-15-THG-D and EP-15-SHG-D.
• Micro-hole drilling capability with hole diameter d ≤ 10 µm for precision processing.

Applications

• Logo, model and origin marking on electronic components and assemblies.
• Marking on food packaging, PVC pipes, pharmaceutical packaging materials (HDPE, PO, PP, etc.).
• PCB marking and cutting; coating removal on metallic and non-metallic layers; micro-hole and blind-hole processing on silicon wafers.
• Marking on low-voltage equipment and fire-resistant materials.

Technical Data Sheet
Machine Model: EP-15/25/30-THG-D
Laser Wavelength: 355 nm
Laser Power: 4W / 7W / 10W / 15W / 25W
Min. Marking Line Width: 10 µm – 15 µm
Marking Speed: 250 characters/sec
Marking Scope: 100 × 100 mm
Standard Lens: F160
Pulse Repetition Frequency: 10–200 kHz
Cooling Mode: Water cooling
Power Supply: AC 220V, 50Hz, 16A
Total Power Consumption: ≤ 1.5 kW
Overall Dimension: 800 mm × 1025 mm × 1500 mm


Characteristics / Technical Specifications

• Machine Model: EP-15/25/30-THG-D
• Laser Wavelength: 355 nm
• Laser Power options: 4W, 7W, 10W, 15W, 25W
• Min. Marking Line Width: 10 µm–15 µm
• Marking Speed: up to 250 characters/sec
• Marking Scope: 100 × 100 mm (standard)
• Standard Lens: F160
• Pulse Repetition Frequency: 10–200 kHz
• Cooling Mode: Water cooling
• Power Supply: AC 220V, 50Hz, 16A
• Total Power Consumption: ≤ 1.5 kW
• Overall Dimensions (W × D × H): 800 mm × 1025 mm × 1500 mm