UV laser cutting machine HDZ-WUVC series

waferfor PCBsingle-phase

Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing 1. With 355nm UV laser, the cutting machine has stable performance, good light spot, and long-time stable operation 2. The reliable and high-precision X-Y-Z-θ worktable and excellent accelerating and decelerating performance can efficiently improve the unit time productivity of system 3. Through vacuum absorption, the wafer cannot move during platform moving 4. The wafer can be positioned through positioning the Mark point on the wafer, which can ensure the cutting precision 5. The high-efficient and flexible software operation system has a simple and concise interface 6. Automatic loading and unloading, robot carrying and automatic edge searching function