Gas pressure controller GR-300

Wafer Back Side Cooling System The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems. Pressure control with more stability and accuracy Mass flow sensor (Option) Compatible for various fitting RoHS compliance In the below example, the GR-300 Series is controling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.