Mass flow regulator GR-511F

for gas

The GR-511F can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. The stability and accuracy of the GR-511F makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems. FEATURES Pressure control with more stability and accuracy Mass flow sensor (Option) Compatible for various fitting RoHS compliance Application example In the below example, the GR-511F is controling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. alve Type - C: Normally close Leak integrity - ≤ 7 × 10-11 Pa·m3 /s (He) Maximum operating pressure - 300 kPa (A) Pressure resistance - 350 kPa (A) Operating temperature - 5-50 °C (Accuracy guaranteed temp : 15-40 °C) Power supply - +15 VDC±5 %, 250 mA -15 VDC±5 %, 250 mA Power consumption - 7.5 VA Interface - Analog Gas *1 - He, Ar, N2 Standard fittings - 1/4 inch VCR or equivalent Pressure full scale - 1.333 kPa (A) (10 Torr), 2.666 kPa (A) (20 Torr), 6.666 kPa (A) (50 Torr) Pressure control range - 1-100 %F.S. Pressure accuracy *2 - ±0.5 %R.S. Zero temperature coefficient - ±0.04 %F.S./°C Span temperature coefficient - ±0.04 %R.S./°C Response *3 - ≤ 1 sec Pressure setting signal - 0.1-10 VDC (1-100 %F.S.) Input impedance ≥ 1 MΩ Option:0.05-5 VDC (1-100 %F.S.) Input impedance≥ 1 MΩ Pressure output signal - 0-10 VDC (0-100 %F.S.) Minimum resistance 2 kΩ Option:0-5 VDC (0-100 %F.S.) Minimum resistance 2 kΩ