Witte microporous vacuum chucks are the ideal solution for clamping and fixing for measuring and test procedures, for precision machining and in silicon wafer production. Substrates such as RFID films or wafers are not deformed by suction holes, suction grooves, etc.
Witte microporous chucks can be heated or cooled, each with appropriate controls. Special systems for transmitted light applications are also available. For microporous surfaces Witte offers a wide variety of materials, for example sintered bronze, ceramics or aluminum. Even black and fluorescent clamping surfaces are available.
measuring, checking and machining of thin-walled substrates (e.g., papers, foils, circuit boards, wafers, PCB boards),
fine (e.g., optics) and
flexible (e.g., rubber) materials
measuring and testing
silicon wafer production
no deformation of the workpieces, as there are no grooves or holes
recessing possible when using a Friction Booster
METAPOR © plates available in different qualities
modular versions for large clamping surfaces
workpiece-specific custom built chucks possible
Witte METAPOR © Fields of application:
Vacuum clamping technology
METAPOR © vacuum clamping systems are characterized by full-surface suction without any bores. Films and foils can be clamped absolutely flat. The pressure drop in the structure makes covering of free surfaces obsolete. METAPOR © is excellently suited for fixing foils and electronic parts as well as a gripper for soft objects.