Thermal conductivity measuring instrument TRSYS20

electronicindustrialfor building

Overview
TRSYS20 is a high-accuracy measuring system used in determining the in-situ thermal resistance (R-value), thermal conductance (Λ-value), and thermal transmittance (U-value) of building envelope components. The system is mostly used for measurements according to standard practices of ISO 9869, ASTM C1046 and ASTM C1155. TRSYS20 is equipped with high-resolution electronics, two heat flux sensors of model HFP01 as well as two pairs of matched thermocouples for differential temperature measurements.

Key features
• ISO and ASTM standard compliance: Fully supports standard measurement practices according to ISO 9869, ASTM C1046, and ASTM C1155, including guard-width-to-thickness ratio and temperature uncertainty requirements.
• Dual measurement locations: Provides two complete measurement channels to deliver redundancy, verify representative wall characteristics, or measure two distinct wall sections simultaneously.
• Matched thermocouple pairs: Individually tested matched thermocouple pairs measure differential temperatures with an uncertainty of better than 0.1 °C across the entire operating range.
• High sensitivity and resolution: High-sensitivity HFP01 sensors and high-resolution MCU electronics ensure dependable data collection at very low heat fluxes down to 0.02 W/m².
• Intuitive browser-based interface: Measurement and Control Unit (MCU) serves an integrated web page via Ethernet or USB—no external software installation required.
• Real-time data quality indicators: Web interface provides real-time heat flux and temperature traces, scatter plots for correlation analysis, and data quality metrics aligned with ISO 9869 criteria.
• Robust and field-ready: Sensors feature IP67 water and corrosion protection, shielded cables for industrial EMC immunity, and are supplied in a rugged carrying case for safe transport between field sites.

Applications
• In-situ measurement of building envelope thermal resistance (R-value) and thermal transmittance (U-value).
• Determination of building wall thermal conductance (Λ-value).
• Building energy audits, thermal performance verifications, and insulation retrofitting assessments.
• Parallel thermal testing on multiple building components or redundant measurements on a single wall section.

Specifications
• Measurands: Heat flux (2 x) [W/m²], differential temperature [°C], and absolute temperature (4 x) [°C]
• Heat flux sensor calibration uncertainty: ±3% (k = 2)
• Heat flux measurement resolution: 0.02 W/m²
• Guard width to thickness ratio: 5 m/m (compliant with ISO 9869 D.3.1)
• Temperature accuracy: < ±0.1 °C (compliant with ISO 9869 paragraph 5.2)
• Temperature measurement resolution: 0.02 °C
• Thermocouple type: IEC 60584-3:2007 type KX (Tolerance Class II)
• Standards governing use: ISO 9869, ASTM C1046, ASTM C1155
• Number of measurement locations: 2
• Data storage capacity: > 30 days
• Measurement duration range: > 3 days (typically 1 to 2 weeks)
• Rated operating temperature (HFP01 and thermocouples): -30 to +70 °C
• MCU operating voltage: 10 to 16 VDC
• MCU connectivity: Ethernet (LAN) or direct USB
• MCU user interface: Browser-based web server (Chrome, Firefox, Internet Explorer, Opera, Safari)
• Power supply unit (PSU) input: 110-220 VAC, 50/60 Hz
• IP protection class:
– Sensors: IP67
– MCU: IP54
– PSU: IP22

System contents and options
• Measurement and Control Unit (MCU)
• Power Supply Unit (PSU)
• 2 x HFP01 heat flux sensors with formally traceable calibration certificates (ASTM C1130)
• 2 x pairs of matched type KX thermocouples (4 temperature sensors total)
• Location 1 cable set: 10 m
• Location 2 cable set: 20 m
• Rugged carrying case for storage and transport