DCB substrate DCB

for power electronics

Features: 0.25-1mm thick ceramic with 0,3mm copper bonded on both sides with Optional Nickel plating DCB thermal expansion matches silicon Optimized for use in power hybrids Excellent Mechanical Strength, Stable Shape with Good Adhesion & Corrosion Resistance Good Thermal Conductivity Very Good Thermal Cycling Capability Good Heat Spreading, leaving no hot spots Can be Structured like PCB or IMS Substrate Basis for Chip-on-board technology