Laser trimming machine

Product Overview
Thin-film Laser Trimmer by JPT Laser. Part of the JPT Chip Resistor Solution product line, the system provides core equipment for chip resistor production, combining laser trimming, scribing and in-line testing. The laser beam is focused to the micron level and scans the resistor surface to ablate material and form precise grooves; a closed-loop measurement system monitors resistance in real time and stops irradiation when the target value is reached.

Key features

• Core equipment for chip resistor manufacturing (laser trimming, scribing, testing)
• Support for multiple laser wavelengths: IR, green, UV to suit different resistor materials and designs
• JPT-developed laser modules available and integrated measurement/feedback for closed-loop trimming
• Narrow kerf widths and multiple cutting profiles (single, L, double, IL, multi/snake, U, stacked, J)
• High channel count and expandability for parallel measurement and high throughput
• Configurable for standard and custom substrate sizes

Applications

• Laser trimming process for thin-film chip resistors and thin-film hybrid circuits on ceramic substrates
• Supports multiple resistor sizes and designs (examples of kerf widths: IR 17–25µm, green 8–12µm, UV 6–10µm)
• Suitable for single-board processing and multi-wavelength trimming strategies

Technical specifications (standard / optional)
Standard
Substrate sizes: 5060 / 6070 / 8084
Product range: 01005–2512
Trimming range: 100mΩ ~ 20mΩ
Trimming accuracy: ±0.05%, ±0.1%, ±1%
Channel configuration: 15 standard relay boards, 240 channels
Laser parameters: IR ＞30W@23kHz; GR ＞2W@80kHz; UV ≥0.8W@80kHz
Galvo scan ranges: IR: 12mm × 75mm@F125; GR: 12mm × 60mm@F100; UV: 12mm × 60mm@F103
Cutting speed: 1mm/s ~ 600mm/s
Cut types: single, L, double, IL, multi (snake), U, stacked, J
Line widths: IR: 17µm–25µm@F125; GR: 8µm–12µm@F100; UV: 6µm–10µm@F103

Optional
Substrate sizes: custom per customer wafer dimensions
Product range: customizable per customer requirements
Trimming range: 20mΩ ~ 500mΩ
Trimming accuracy: ±0.05%, ±0.1%, ±1%
Channel configuration: expandable to 15 ultra-low-resistance relay boards, 240 channels
Optional laser examples: IR: 30µm–50µm@F160 (example)
Optional galvo scan range example: 12mm × 100mm@F160
Cutting speed: 1mm/s ~ 600mm/s
Line width (optional example): IR: 30µm–50µm@F160

Demo / Attachments
Product page includes demonstration video (MP4) and sample footage showing actual trimming operations and results.

Technical characteristics (key points)

• Measurement range (overall): 0.1Ω – 500MΩ (specific series ranges vary by model)
• Measurement accuracy examples: ±0.01% (series-dependent)
• Support for multiple wavelengths (IR / green / UV) to match material and design requirements
• Multiple cut profiles and trimming algorithms for complex resistor geometries
• High channel count measurement and expandability for parallel processing and high throughput