Printed circuit laser trimming machine

Overview
The Ultra-low Resistance Laser Trimmer is a production-grade laser trimming system designed to trim and fine‑tune ultra‑low ohm resistors. The system focuses a laser beam to micron scale and ablates the resistive layer to modify conductive cross-section or length, enabling precise resistance adjustment for ceramic, PCB, lead‑frame and single‑piece resistors. Manufacturer: Shenzhen JPT Optoelectronics Co., Ltd. (JPT).

Key data

• Resistance range: 0.1 mΩ–1 Ω
• Adjustment accuracy (product variants): ±0.1% / ±0.5% / ±1%
• Supported resistor sizes: 01005–2512
• Standard channel configuration: 15 relay boards, 240 channels

Product advantages

• Custom JPT laser modules: configurable power and wavelength options (IR, green, UV) with in‑house quality control and 72‑hour aging test for long‑term stability.
• High‑speed, high‑precision trimming: galvanometer scanning combined with closed‑loop measurement enables repeatable adjustments at production throughput.
• Automation & intelligent features: power monitoring, automatic measurement calibration, auto alignment for trimming, and motorized material handling to support automated lines.

Applications

• Laser trimming of ultra‑low resistance chip resistors, PCB resistors, lead‑frame and single‑piece resistors in high‑volume production.
• Typical blade/line widths: IR 35 μm (blade), green 30 μm, UV 25 μm; standard line widths IR 20–40 μm, GR 15–20 μm, UV 10–20 μm.
• Substrate processing: supports standard and custom substrate sizes (see technical specifications).

Technical specifications

• Substrate size (standard): 50 × 60 mm – 80 × 84 mm; options: 70 × 130 mm, 250 × 300 mm; customization available.
• Trimming range: 0.1 mΩ – 1 Ω
• Trimming accuracy: variants ±0.1%, ±0.5%, ±1% (product header options ±0.1 / ±0.5 / ±1)
• Laser parameters: IR > 30 W @ 23 kHz; Green > 4 W @ 10 kHz; UV ≥ 3 W @ 40 kHz
• Galvo scan range (standard): IR 12 × 75 mm; GR 12 × 60 mm; UV 12 × 60 mm; optional 12 × 100 mm @ F160
• Trimming speed: 1 mm/s – 600 mm/s
• Blade types: single, L, double, IL, multi (snake cut), U‑shape, stacked, J‑shape
• Line width (standard): IR 20–40 μm; GR 15–20 μm; UV 10–20 μm; optional IR 30–50 μm @ F160