Optical inspection system CIRCL™-AP

3D2Dautomatic

CIRCL™-AP is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer-level packaging (AWLP) process control. The CIRCL-AP tool is utilized for multiple AWLP applications requiring high sensitivity including 2.5D/3D integration, wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP). With support for bonded, thinned and warped substrates, CIRCL-AP provides production-proven process control and monitoring strategies for Cu-pillars, bumps, through silicon vias (TSVs), redistribution layer (RDL), hybrid bonding and other packaging process flows. The latest CIRCL-AP system supports a broader range of wafer thicknesses for both the front side wafer inspection and metrology module, as well as the optical review module. Process monitor, Outgoing Quality Control (OQC), Tool monitor, Backside monitor, Edge yield monitor, Process tool qualification