Joint paste E12

soldercopper basedsilver based

Solder Paste for IGBT / MOSFET Module Manufacturing that Requires No Cleaning Ultimately Low Voiding E12 series ensures extremely low voiding regardless of the type of solder alloy. Also, it does not cause solder to splatter even with 600μm thick stencil. Got Problems with Solder Splattering? E12 series ensures stable and consistent soldering performance with ultra low voiding and low splattering even on a large joint area which commonly requires a thick stencil specially for a power semiconductor device application.