Thermally conductive gap filler Tflex™ CR910

Product description
Tflex™ CR910 is a soft, compliant liquid gap filler formulated as a two-part, dispensable system that cures at room temperature. With a thermal conductivity of 9.2 W/mK and a Shore 00 hardness of 65, it is designed to bridge large gap tolerances while providing reliable thermal interface performance and meeting vertical shock and vibration requirements.

Features and Benefits

• Thermal conductivity: 9.2 W/mK
• Dispensable, compliant material suitable for uneven interfaces
• Easily reworkable for service and repair
• Optimized for large gaps and variable bondline thickness
• Compliant with RoHS and REACH

Capabilities

• Automated packaging
• Automated pad placement
• Custom automation
• Custom product development
• Modeling
• Prototyping
• Service
• Testing

Documents (selected)

• Tflex CR910 datasheet — Last updated 09/16/26
• Tflex CR910 SDS part B — Last updated 02/25/26
• Tflex CR910 SDS part A — Last updated 02/25/26
• Tflex CR910 RoHS and REACH certificates — Last updated 02/25/26
• Tflex CR910 dispensing guideline — Last updated 03/10/26

Technical specifications

• Color: light pink
• Density (g/cc): 3.14
• Minimum bondline thickness (µm): 200
• Operating temperature max (°C): 180
• Operating temperature min (°C): -40
• Shelf life: 6 months
• Thermal conductivity (W/mK): 9.20
• Hardness (Shore 00): 65
• REACH: Yes
• ROHS compliant: Yes
• UL flammability rating: V0