Adhesive label ARGIPRINT°

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Summary
Two industrial options for high-temperature labelling: polyimide film with silicone adhesive (resistant up to +300 °C, printable by thermal transfer) and ARGIPRINT° substrate (resistant up to +500 °C, no adhesive; fixed mechanically with wire, cable tie or bolt). Choice depends on process peak temperature, substrate surface and whether adhesive application is acceptable or mechanical fixing is required.

Key properties

• Max temperature: +500 °C (ARGIPRINT°), +300 °C continuous (polyimide).
• Fixation: silicone adhesive (polyimide) or mechanical fixation (ARGIPRINT°: wire, cable tie, bolt).
• Printing: thermal transfer with resin ribbon.
• Base: gold-coloured polyimide film or dedicated ARGIPRINT° substrate.

Common applications

• Identification of parts in curing and paint ovens.
• Traceability of components during welding processes (including PCB reflow and wave soldering for polyimide).
• Marking in continuous high-temperature environments (industrial furnaces, heat treatments).
• Labeling metal parts in foundry, injection molding, shot blasting and galvanizing processes.

Fixation and adhesives
Polyimide uses a high-temperature silicone adhesive (suitable to ≈+300 °C). ARGIPRINT° has no adhesive and is attached mechanically using wire, cable tie or bolt.

Material variants

• Polyimide +300 °C: gold-coloured film with silicone adhesive, printable by thermal transfer with resin ribbon.
• ARGIPRINT° +500 °C: substrate without adhesive or liner; mechanical fixation; suited to furnaces and extreme processes.

Constructions (summary by product)
ARGIPRINT° — extreme high temperature
Construction: ARGIPRINT° without liner or adhesive. Fixation: mechanical (wire, cable tie, bolt). Printing: thermal transfer with resin ribbon. Typical use: industrial furnaces, shot blasting and galvanizing. Peak temperature up to +500 °C.

Polyimide — up to +300 °C
Construction: gold polyimide film with high-temperature silicone adhesive. Printing: thermal transfer with resin ribbon. Typical use: PCB reflow, SMD soldering and component marking in electronics. Continuous temperature up to +300 °C.

Comparison
Material | Max temp. | Fixation | Printing | Typical use
ARGIPRINT° | +500 °C | Mechanical | Thermal transfer (resin) | Furnaces, shot blasting, galvanizing
Polyimide | +300 °C | Silicone adhesive | Thermal transfer (resin) | PCB reflow, SMD soldering, electronics

Selection criteria

• Choose a high-temperature substrate when the label remains with the part during thermal processes (oven, curing, soldering) or when sustained process temperatures exceed ≈+150 °C.
• If the label is applied cold and the part does not exceed ~+100 °C in service, standard polyester (PP/PET) may be sufficient and more economical.
• Polyimide requires a clean, flat surface for adhesive performance; ARGIPRINT° is suitable for mechanical fixation on rough, rusty, oily or irregular geometries.
• Neither substrate is compatible with standard inkjet or untreated toner printing; recommended printing method is thermal transfer with resin ribbon.

Limitations and considerations

• Standard acrylic adhesives do not exceed ~+150 °C; for higher ranges use silicone adhesive or mechanical fixation.
• Cost per label: high-temperature materials are typically significantly more expensive than standard PP or PET in large volumes.

Characteristics / technical specifications

• ARGIPRINT°: max temperature +500 °C; no adhesive; mechanical fixation (wire, cable tie, bolt); thermal transfer printing (resin ribbon); construction without liner.
• Polyimide: continuous max temperature +300 °C; gold polyimide film with high-temperature silicone adhesive; printable by thermal transfer with resin ribbon; suitable for SMD processes, reflow and wave soldering.
• Process resistance: both suitable for extreme thermal environments depending on variant; choice depends on need for adhesive and surface condition.
• Recommended print format: Thermal transfer (TTR) with resin ribbon to ensure readability of codes (DataMatrix, QR, barcodes) after thermal exposure.