Fastening adhesive tape

mountingdouble-sidedfoam

Overview
Lohmann's Debonding on Demand integrates durable adhesive bonding with controlled-release capabilities to support repair, reuse and circular manufacturing. The technology is engineered to provide secure bonds in service while enabling clean, selective removal when required.

Designed for Disassembly
Debonding on Demand solutions are developed to enable predictable, residue‑free disassembly. They are intended for product lifecycles where maintenance, refurbishment or recycling are planned, and where component integrity must be preserved during separation.

Key Benefits

• Secure bonding during normal use with the option of selective, residue‑free removal when activated.
• Residue‑free lift‑off enabled by foam adhesive tapes with integrated reinforcing films for clean component separation (e.g., scanner rails).
• Repair & maintenance facilitation via hook & loop double‑sided tapes and other designs allowing tool‑free panel removal (e.g., appliance front panels).
• Support for reuse and recycling: separation mechanisms that preserve component integrity and reduce electronic waste.
• Customization: more than 700 bonding system variants and 10,000+ application references enable tailored solutions for specific product environments.

Triggers and Release Mechanisms
General Triggers
These rely on intrinsic adhesive properties such as heat sensitivity or mechanical response. They are simple to implement and suitable where access is straightforward and safety constraints are limited.

Advanced Triggers
Engineered triggers are integrated into tape design and product concepts for controlled, application‑driven debonding. Examples include UV activation, targeted thermal input and built‑in mechanical release features to achieve safe, scalable and precise separation in complex assemblies.

Common Trigger Types

• Tearing
• Temperature
• Solvent
• Electricity
• Cutting
• Combination
• Stretching
• Radiation (e.g., UV)

Applications & Use Cases
Typical use cases cover automotive components, consumer and industrial electronics, home appliances, medical wearables and industrial equipment where controlled disassembly enables repair, refurbishment or recycling. Solutions are selected to meet product‑specific technical and regulatory constraints.

Technical characteristics / specifications

• Technology name: Debonding on Demand (Lohmann)
• Standards reference: referenced to DIN/TS 54405 for debonding concepts
• Product variants: >700 bonding system variants; 10,000+ application references worldwide
• Material concepts: foam adhesive tapes with integrated reinforcing films; hook & loop double‑sided tapes; other tailored tape constructions
• Trigger options: general triggers (heat, mechanical) and advanced triggers (UV activation, thermal triggers, engineered mechanical release)
• Performance targets: secure bond in use, controlled and residue‑free removal when triggered; suitability for reuse/repair/recycling workflows