Laser PCB etching machine Fusion3D 1500

for printed circuits

The LPKF Fusion3D 1500 system transfers the proven LDS technology of smart phone antennas to larger components. The design features compact enclosed system with handling module and linear actuators to ensure precise motion and control. A linear system with two drives moves the components into the processing area. The structures can be flexibly produced up to 400 x 78 mm large and with a maximum height of 80 mm one after another. While one train is processed with the laser, the second automatically moves into position, which completely eliminates any non-production time. It is possible to optionally upgrade to a multiple processing unit controller (MPC) which enables to install up to three processing units to share structuring tasks to ensure systems throughput. LDS technology supports the designers to meet ongoing demands for integrating more functions in smaller spaces.