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Epoxy adhesive EP29LPSPND-3for metaltwo-componentsealing
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Characteristics
- Chemical composition
- epoxy
- Type of substrate
- for metal
- Number of components
- two-component
- Applications
- for bonding, sealing, for cryogenic applications
- Technical characteristics
- electrically insulating, thermal insulation
- Working temperature
Min.: 130 °F
(54.44 °C)Max.: 250 °F
(121.11 °C)
Description
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative.
Key Features include:
-Paste consistency
-Exceptionally long working life
-Electrically and thermally insulative
-Can withstand cryogenic shock
Catalogs
No catalogs are available for this product.
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Epoxy systems
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.