The 11AOHT master bond polymer system comes with a two-component epoxy resin structure, which ensures high performance sealing and bonding, is suitable for curing at room temperature and very fast at elevated temperatures. The mix ratio of 1:1 defined by weight or volume is advantageous, while the item contains the most outstanding features for a product of its kind, including excellent electrical insulation properties, high thermal conductivity and resistance to temperatures of up to 400 degrees Fahrenheit.
The item comes in the form of a paste that can be applied without dripping or sagging, even on vertical surfaces. It is suitable for applications that involve thermal cycling. The product is also resistant to chemicals and comes with excellent adhesion properties for most ceramics, glass types and metals.
- Superior physical strength properties
- Room temperature curing
- Toughened system, withstands thermal cycling
- Meets MIL-STD-883J Section 3.5.2 for thermal stability
Master Bond Supreme 11AOHT is a two component epoxy resin system for high performance bonding, coating and sealing. It has a convenient, forgiving, one to one mix ratio by weight or volume. It is formulated to cure at room temperature or more rapidly at elevated temperatures with the optimum being 8-12 hours at room temperature followed by 1-2 hours at 150-200°F. It is relatively fast setting and a 100 gram mass has an open time of about 20-30 minutes.