Epoxy resin EPON 58005
encapsulationfor electronic applcationscomposite

epoxy resin
epoxy resin
epoxy resin
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Characteristics

Type
epoxy
Applications
encapsulation, for electronic applcations, composite
Other characteristics
high-performance

Description

EPON™ Resin 58005 is an elastomer modified epoxy-functional adduct formed from the reaction of the diglycidyl ether of bisphenol A and a carboxyl terminated butadiene-acrylonitrile elastomer. The Elastomer content is approximately 40% by weight. The primary use of EPON 58005, similar to the EPON 58034 is the modification of conventional epoxy systems to increase flexibility, adhesion properties, and fatigue resistance. Application Areas/Suggested Uses High-performance adhesives, featuring: Higher peel and shear strengths Thermal shock resistance Greater fatigue resistance Fatigue resistant composite structures Benefits of EPON 58005 High elastomer content – convenient adjustment of elastomer content Compatible with a wide range of liquid epoxy resins Imparts improved peel strength and fatigue resistance with minimal reduction of stiffness and maximum operating temperature General Information As a result of a relatively high acrylonitrile content, EPON 58005 is compatible with most epoxy resin types, including bisphenol F and novolac epoxies, within the typically used range of concentrations (<50% by weight). The concentration of this modifier required for optimum performance is dependent upon factors of resin type, curing agent type, and specific performance requirements, but is generally found to be within the 20 – 50% by weight range.

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