Epoxy resin curing agent EPIKURE 3295

EPIKURE 3295, a very low viscosity aliphatic amine adduct, is recommended for curing epoxy resins at room or moderately elevated temperatures. Its reduced vapor pressure, less critical combining ratio, superior electrical properties, and non-fuming characteristics make it safer and more convenient to handle than the aliphatic polyamines such as diethylenetriamine. EPIKURE 3295 is ideally suited for many casting, laminating, and impregnation operations and certain coating applications. It can be diluted with water and is useful as a curing agent for aqueous resin systems. Brush head potting compounds Laminated and cast tooling High-build maintenance coatings EPIKURE Curing Agent 3295 is relatively reactive and imparts a high degree of rigidity and mechanical strength to cured systems. The pot life, exothermic temperature rise and curing time of compositions containing EPIKURE 3295 depend on batch size, filler type, filler loading, and temperature. For example, a 1-pound batch of a mixture containing EPON™ Resin 828 and EPIKURE Curing Agent 3295 blended at room temperature has a pot life of less than 20 minutes and develops a maximum temperature above 200 °C (392 °F). Unfilled compositions based on EPON 828 and EPIKURE 3295, in thin sections where exothermic heat is readily dissipated, require 6 to 12 hours at room temperature to gel and develop handling strength; full strength is reached after several days. Although castings as thick as 1 inch can be prepared under carefully controlled conditions, the maximum thickness recommended for the unfilled composition is about 1/2 inch.