Soft Termination Chip Multilayer Ceramic Capacitors for General Purpose
Cracking caused by flexing stress after board mounting is minimized due to resin external electrodes!
1. The resin external electrodes suppress cracks by board deflection.
Cracking of the ceramic element is suppressed by the resin of the external electrodes, which releases the stress.
2. Suppresses the occurrence of cracking caused by deflection stress at the time of board mounting, etc.
3. Ideal for consumer and industrial electronic equipment, etc. where there heat stress, vibration and impact are applied.