Computer for railway applications nROK1031/-C2
embeddedIntel® Atom x6413Equad-core

computer for railway applications
computer for railway applications
computer for railway applications
computer for railway applications
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Characteristics

Type
embedded
Processor
Intel® Atom x6413E, quad-core
Ports
RS-232, HDMI, SATA, CAN bus, Mini PCIe, VGA, DDR4 SO-DIMM, USB 3.2, SIM card, USB 2.0, USB 3.0, RS-485, GPS, RS-422, 5G
Domain
video surveillance, for railway applications, for vehicle diagnostics
Other characteristics
fanless, PoE, Edge AI, multimedia, Linux, Windows 10, Windows 11 IoT Enterprise, compact, rugged

Description

nROK1031 features next-generation Intel Atom® x6413E processor quad-core 1.5GHz, with powerful graphics and multimedia enhancements. It offers an onboard CAN 2.0B for vehicle diagnostics, and an advanced GNSS receiver supporting GPS+QZSS/Glonass/Galileo/Beidou. Moreover, for connectivity, optional WLAN (Wi-Fi 5/6/6E) and WWAN (LTE/5G NR) wireless data. In consideration for convenience, there are dual micro-SIMs and one micro-SIM with an external access design, allowing users to easily access the micro-SIM card. Equipped with an optional AI accelerator M.2/mPCIe module, the nROK1031 also functions as a reliable AI edge computing platform, providing innovative AI solutions for the rolling stock. With a rugged, fanless, and compact enclosure, this fanless computer can easily be installed. The nROK1031-C2 provides dual IEEE 802.3af/at PoE functions and is suited for most PoE devices. This includes connecting with wireless access points and IP cameras. Furthermore, an additional 12VDC output can be provided for an external display via easy power wire arrangements. nROK1031 is a flexible rolling stock computer that meets the various demands of train applications, such as wireless gateway, infotainment NEXCOM is a Titanium member of the Intel® Partner Alliance, as a top tier of the Alliance. Intel and more than 500 global IoT partners of the Intel® Partner Alliance provide scalable, interoperable Intel® -based technologies and solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first in-market solutions.

Exhibitions

Meet this supplier at the following exhibition(s):

embedded world 2024
embedded world 2024

9-11 Apr 2024 Nuremberg (Germany) Hall 5 - Stand 5-253

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.