Anti-corrosion coating ELEP COAT LSS

Overview
This moisture‑preventing liquid sealing compound protects printed circuit boards from humidity, temperature variations and other environmental factors. ELEP COAT LSS Series is a rubber‑modified liquid sealant designed for PCB moisture protection with rapid film formation.

Features

• Insulating and moisture‑proof coating material that protects PCBs in harsh environments (high temperature and high humidity).
• Low Young's modulus and low coefficient of thermal expansion to minimise mechanical stress on components.
• Provides moisture‑proofing, waterproofing, electrical insulation, dust resistance and surface protection.
• Reliable adhesion and quick film formation (typically 3 to 15 minutes after application depending on variant and thickness).
• High elasticity and corrosion‑resistant properties; available in multiple variants to suit application requirements.

Properties (representative measurement examples)

• Solid content — LSS‑520MH: 25% / LSS‑540E: 40% (representative)
• Solution viscosity (25°C) — LSS‑520MH: 400 mPa·s / LSS‑540E: 12 mPa·s
• Young's modulus — LSS‑520MH: 75 MPa / LSS‑540E: 9.2 MPa
• Elongation at break — LSS‑520MH: 460% / LSS‑540E: 500%
• Water‑vapour permeability (100 µm) — LSS‑520MH: 0.002 g/cm²·day / LSS‑540E: 0.0035 g/cm²·day (40°C, 90% RH)
• Volume resistivity — LSS‑520MH: 3.3 × 10^16 Ω·cm / LSS‑540E: 2.4 × 10^16 Ω·cm (JIS C2107)
• Dry‑to‑touch time (20 µm) — LSS‑520MH: approx. 5 min / LSS‑540E: approx. 15 min

Applications

• ELEP COAT is a liquid sealing compound based on rubber‑modified materials.
• Applied to the component side of substrates to protect against moisture, condensation, dust and vibration.
• Insulating, moisture‑proof compound that exerts low stress on components and helps prevent substrate issues such as cracks or leakage currents.

Additional information
* Measurements provided are representative examples and are not guaranteed.

Technical characteristics / specifications

• Product family: ELEP COAT LSS Series
• Main formulation: rubber‑modified liquid sealing compound
• Quick film formation: typically 3–15 minutes after application (depends on variant and thickness)
• Typical solid content: e.g. LSS‑520MH 25%, LSS‑540E 40%
• Typical solution viscosity (25°C): e.g. LSS‑520MH 400 mPa·s, LSS‑540E 12 mPa·s
• Young's modulus: e.g. LSS‑520MH 75 MPa, LSS‑540E 9.2 MPa
• Elongation at break: e.g. LSS‑520MH 460%, LSS‑540E 500%
• Water‑vapour permeability (100 µm): e.g. 0.002–0.0035 g/cm²·day (40°C, 90% RH)
• Volume resistivity: on the order of 10^16 Ω·cm (JIS)
• Dry‑to‑touch time (20 µm): typ. 5 min (varies by variant)