Snap-on insert EDI®

metalfor thermoplasticsfor plastics

Overview
The EDI® Layer Multiplication Technology (LMT) is a layer multiplier designed for integration with coextrusion feedblocks to create microlayer structures for film and sheet production. It multiplies selected layers from a feedblock "sandwich" and transfers the microlayer stack into the die manifold to produce finished film or sheet with the target width and overall thickness.

Experience & development
US Patent: 9,108,218. Development of the technology began in the early 2000s as part of government-funded work; the patented EDI® system was commercialized in 2009 and has been refined through industrial field applications.

How it works (summary)
The system inserts a network of microlayers upstream of the die via a coextrusion feedblock. The microlayered structure is consolidated in the manifold and die to yield a film or sheet that retains the designed overall thickness while containing a high number of internal micro-layers.

Features at a glance

• Compatibility: Works with EDI® adjustable and fixed-geometry feedblock designs.
• Quick-change inserts: Inserts allow rapid adjustment of layer-multiplication levels.
• Compact footprint: Streamlined design minimizes required installation space.

Benefits for your process

• Maintain target film/sheet thickness while increasing internal layer count.
• Improve barrier performance: reduced oxygen transmission rate (OTR) and lower total oxygen ingress for extended shelf life in food packaging applications.
• Increase thermoformability: microlayer structures can enhance downstream thermoforming performance.

Typical applications

• Retort and hot-fill food packaging
• Flexible barrier packaging requiring improved OTR
• Thermoformable films and sheets
• Hygienic/ breathable films and optically sensitive films

Literature / resources

• EDI Coextrusion Technology (technical literature)
• EDI Technology Center (technical resources)

Technical specifications

• Technology: EDI® Layer Multiplication Technology (LMT)
• Patent: US 9,108,218
• Designed for: film and sheet coextrusion processes (feedblock + die manifold)
• Compatibility: EDI® adjustable and fixed-geometry feedblocks
• Adjustability: quick-change inserts for fast layer-multiplication changes
• Footprint: compact/streamlined design
• Process benefits: maintains overall thickness, reduces OTR/oxygen ingress, improves thermoformability