OverviewProcessors face challenges ensuring uniform coating or laminating material distribution across the web width while avoiding flooded or starved edges. EDI® EPC™ die systems are custom designed to control edge profile, reduce edge bead and trim, maintain consistent polymer distribution and improve process stability and material yield.
Key benefits- Reduce trim and material waste by minimizing edge bead and enabling precise edge flow control.
- Improve process stability through uniform polymer distribution across the substrate width.
- Faster servicing and easier cleaning with deckle and die-body designs that limit fastener removal and provide rapid access.
- Adaptable integration to new or existing production lines to meet specific production parameters.
Features at a glanceCoextrusion & Gauge ControlCoextrusion Capabilities: Die mates with Ultraflow™ V-T adjustable or Ultraflow™ I fixed-geometry feedblocks and integrates with EDI® Layer Multiplication Technology (LMT).
Gauge Control: Prodigi™ motorized lip actuator, Autoflex™ automatic or manual lip adjustment systems available.
Designed to Suit Your ProcessDeckling Capabilities: EPC™ dual deckle system (internal with external back-up) for enhanced sealing and fine flow control to die ends.
Finishing Options: Multiple surface finishes available, including chrome plating or alternative coatings depending on application.
Production Line Integration: Adaptable interfaces for new or existing lines.
Additional Features: Optional motorized deckle drive available for the EPC™ system.
How EPC™ Benefits Production- Minimize Trim Width — Internal deckle blade system allows quick product-width adjustment and precise flow control at die ends to reduce edge beads to minimal amounts.
- Increase Extruder Uptime — Limited fasteners for deckle access minimize downtime; retractable deckle assemblies permit insertion of custom brass scrapers for efficient lip cleaning.
- Operational Simplicity — Designs consider operation and maintenance to deliver robust, easy-to-operate equipment with superior edge-profile control.
Application Areas- Extrusion coating and laminating lines for flexible packaging and technical films.
- Processes requiring coextrusion (multi-layer structures) and precise gauge control.
- Operations seeking to reduce trim, scrap and material costs while improving uniformity.
Associated Technologies / Options- Ultraflow™ V-T adjustable and Ultraflow™ I fixed geometry feedblocks.
- EDI® Layer Multiplication Technology (LMT) for multilayer constructions.
- Prodigi™ motorized lip actuator system; Autoflex™ automatic and manual lip adjustment options.
- EPC™ dual deckle (internal + external backup) and optional motorized deckle drive.
Customer FeedbackCustomers report elimination or significant reduction of edge bead and related scrap after replacing legacy dies with EPC™ systems; some users achieved zero edge bead and measurable material savings.
Specifications / Technical data- Series / Model: EDI® EPC™ die systems (custom-designed per application)
- Coextrusion compatibility: Ultraflow™ V-T and Ultraflow™ I feedblocks; supports Layer Multiplication Technology (LMT)
- Gauge control options: Prodigi™ (motorized), Autoflex™ (automatic), manual lip adjustment
- Deckle: EPC™ dual deckle (internal + external backup); optional motorized deckle drive
- Finishes: Chrome plating and alternative surface coatings available
- Serviceability: Limited fasteners for rapid access; retractable deckle assemblies for scraper insertion and cleaning
- Integration: Configurable to new or existing production lines