macro defect inspection machine / automated / for wafers / surface
F30™

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macro defect inspection machine macro defect inspection machine - F30™
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Characteristics

  • Technology:

    automated

  • Applications:

    for wafers, surface

  • Other characteristics:

    defect, high-resolution, macro defect

Description

Designed to blur the lines between dark field micro inspection and traditional macro inspection, the F30 System provides automated defect inspection for front-end and outgoing quality (OQA) applications.

Product Overview

The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.

Applications

After develop inspection (ADI)
Fab Outgoing QA
Post CMP inspection
After etch inspection

Specifications

Throughput up to 120 wph (10µm)
Resolution flexibility (10µm to 0.5µm)
Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer
Teams with edge and backside modules for all-surface solution