Reflow soldering machine SB² – USP

laserflexiblefor electronic components

PacTech’s new SB²-USP machine solution expands the SB² product family of laser soldering systems to include a highly flexible and universal soldering platform for component assembly and laser soldering in the SMT sector, especially for high-volume production in the automotive industry. This platform sets new standards in automation, application spectrum and production quality. The combination of several robots with a variety of PacTech’s unique process modules such as solder jetting, laser wire soldering, wire bonding, dispensing and laser reflow overcomes the process-related limitations of conventional soldering and joining systems. Take your demand for efficiency and multifunctionality to a new level. Highlights • SMT component Assembly • Die- and Pin Soldering • Solder Jetting • Laser Reflow • Flux- and Solderpaste Dispense Options • Pick & Place Scara Robot • 6 Axis Soldering Robot • Inline Conveyer • Solder Ball Size: 1-2mm • UPH: >1000 (2-Pin product)